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Thermoelectric cooler (TEC) having top and bottom plates with asymmetric thermal conductivity and an optical subassembly implementing the same

A technology of thermal conductivity and sub-components, applied in the field of optical communication, can solve problems such as thermal management insertion loss

Pending Publication Date: 2021-01-12
APPLIED OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In order to provide higher speed in a smaller optical transceiver module at a lower cost, challenges such as thermal management, insertion loss and manufacturing yield will be faced

Method used

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  • Thermoelectric cooler (TEC) having top and bottom plates with asymmetric thermal conductivity and an optical subassembly implementing the same
  • Thermoelectric cooler (TEC) having top and bottom plates with asymmetric thermal conductivity and an optical subassembly implementing the same
  • Thermoelectric cooler (TEC) having top and bottom plates with asymmetric thermal conductivity and an optical subassembly implementing the same

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Embodiment Construction

[0069] As mentioned above, some optical transmission systems transmit and receive channel wavelengths over relatively long transmission distances, eg, up to 2 kilometers or more. In order to maintain the rated performance, optical signal quality becomes important at such long distances. One method of maintaining optical signal quality involves temperature control devices such as thermoelectric coolers in thermal communication with laser diodes (LDs) in transmitters / transceivers to maintain operating temperatures and minimize or At least the wavelength shift is reduced. However, the thermal performance of temperature control devices is generally limited relative to the materials used to form the temperature control devices.

[0070]For example, the top and bottom plates of some thermoelectric coolers use alumina, so such thermoelectric coolers, for example, can have a thermal conductivity of about 40 W / mK (Watts per meter Kelvin) at room temperature. On the other hand, alumin...

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Abstract

In general, the present disclosure is directed to a thermoelectric cooler (TEC) that includes a top plate or bottom plate being formed of a high thermal conductivity material, and the other of the topplate and bottom plate being formed of a low thermal conductivity material, with the high thermal conductivity material having a thermal conductivity at least twice, and preferably five times, that of the thermal conductivity of the low thermal conductivity material. This disparity in thermal conductivity between the top plate and bottom plate materials may be referred to herein as asymmetric thermal performance.

Description

technical field [0001] The present invention relates to optical communications, and more particularly to a thermoelectric cooler (TEC) with multiple face elements with asymmetric thermal performance and an optical subassembly implementing the same. Background technique [0002] Optical transceivers can be used to send and receive optical signals for but not limited to various applications such as internet data center, cable TV broadband and fiber to the home (FTTH). For example, transmission with optical transceivers can provide higher speed and wider bandwidth over longer distances than transmission with cables made of copper. In order to provide higher speed in a smaller optical transceiver module at a lower cost, there are challenges such as thermal management, insertion loss and manufacturing yield. [0003] An optical transceiver module generally includes one or more optical transmitter subassemblies (transmitter optical subassembly, TOSA) for transmitting optical sign...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42F25B21/02F25B49/00
CPCG02B6/4271F25B21/02F25B49/00F25B2321/023H01S5/02415H01S5/02438H01S5/02251H10N10/17H04B10/501H01S5/06804
Inventor 何宜龙李秦王冲
Owner APPLIED OPTOELECTRONICS