Purification chamber and semiconductor process equipment

Abstract

The invention provides a purification chamber and semiconductor process equipment, the purification chamber is used for being connected with a process chamber in the semiconductor equipment in the semiconductor equipment, the purification chamber comprises a chamber body, a first chamber cover and a second chamber cover, the chamber body is at least provided with a first chamber opening and a second chamber opening, the first chamber opening is used for conveying a to-be-machined workpiece to the process chamber, the second chamber opening deviates from the first chamber opening, and the firstchamber cover and the second chamber cover are used for opening and closing the first chamber opening and the second chamber opening respectively; and the purification chamber further comprises a sealing structure, and the sealing structure is at least arranged at the end, located at the first chamber opening, of the chamber body in a sealed mode and used for conducting surface sealing between the end, located at the first chamber opening, of the chamber body and the first chamber cover when the first chamber cover closes the first chamber opening. According to the purification chamber and the semiconductor process equipment provided by the invention, the sealing performance of the purification chamber can be improved, and the process result is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a clean chamber and semiconductor process equipment. Background technique [0002] When the vertical oxidation furnace is used as the heat treatment process equipment to carry out the silicon dioxide film growth process, in order to make the silicon wafer to be processed only grow the oxide film in the vertical oxidation furnace, so that the silicon wafer to be processed can be free of defects, To grow a silicon dioxide film uniformly, it is necessary to set up a purification chamber in the vertical oxidation furnace equipment. During the process of the film entering the vertical oxidation furnace, no oxygen is involved in the whole process. [0003] The purification chamber generally includes a chamber body and two sealing covers, wherein the chamber body has two chamber ports, and the two sealing covers are respectively used to open or close the two chamber por...

AI Technical Summary

Problems solved by technology

[0005] However, since the wall of the chamber body is relatively thin, the end of the chamber body is approximately in line contact with the sealing ring. Therefore, if the end of the chamber body is not aligned with the surface axis of the sealing ring, or, If the surface of the sealing ring is uneven due to quality problems or deformation by external force, there will be a loose seal between the end of the chamber body, resulting in poor sealing of the purification chamber.

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