Polyamide moulding compound and use thereof and moulded bodies produced from said moulding compound

A technology of polyamide and molding compound, applied in the field of molding compound in the preparation of molded products, can solve the problems of prolonging the cooling time and the like

Pending Publication Date: 2021-02-09
EMS PATENT AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It must be admitted here that the high temperature of the injection mold improves the surface quality, but also prolongs the cooling time until the demolding temperature is reached

Method used

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  • Polyamide moulding compound and use thereof and moulded bodies produced from said moulding compound
  • Polyamide moulding compound and use thereof and moulded bodies produced from said moulding compound
  • Polyamide moulding compound and use thereof and moulded bodies produced from said moulding compound

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Experimental program
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preparation example Construction

[0142] The preparation of the copolyamides according to the invention is carried out in a manner known per se in a known stirrable autoclave having a display vessel and a reaction vessel:

[0143] Deionized water is present in the display container with added monomers and possible additives. This is followed by several inerting treatments with nitrogen. Heat to 180°C to 230°C while stirring at the pressure employed to obtain a homogeneous solution. The solution is pumped through a screen into the reaction vessel and heated to the desired reaction temperature of 250°C to 300°C at a pressure of maximum 30 bar. During the pressure stage, the reaction system is maintained at the reaction temperature for 2 hours to 4 hours. During the subsequent expansion phase, the pressure drops to atmospheric pressure within 1 to 2 hours, while the temperature may drop slightly. In the subsequent degassing stage, the reaction system is maintained at atmospheric pressure and a temperature of 2...

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PUM

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Abstract

The present invention relates to polyamide moulding compounds that contain a semi-crystalline copolyamide, at least one filler, and optionally additives. The invention likewise relates to mouldings manufacture from these moulding compounds and to the use of the moulding compounds to manufacture mouldings.

Description

technical field [0001] The invention relates to polyamide molding compounds comprising semicrystalline copolyamides, at least one filler and optionally additives. The invention also relates to the moldings produced from these molding materials and to the use of the molding materials for the production of moldings. Background technique [0002] A variety of polyamide molding compounds are known in the prior art, the composition of the molding materials being adapted to their required performance characteristics. Especially for reinforced polyamide molding compounds, in addition to favorable mechanical properties, molded articles made from them should also have a glossy and smooth surface. The technical processability of the molding compound should not be compromised in the process. However, for glass fiber reinforced injection molded products, due to irregularities or due to the effect of glass fibers, the surface of the molded part is usually dull and rough. However, this...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/06C08K7/14C08K5/134C08K3/04C08K3/34
CPCC08K7/14C08K5/1345C08K3/04C08K3/346C08K3/34C08L77/06C08G69/265C08K3/014C08K3/013
Inventor 菲利普·哈德克里斯汀·舒伯特尤尼·埃布林
Owner EMS PATENT AG
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