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A Four-phase Coupled Inductor on Chip with Closed Magnetic Circuit

A technology of coupled inductance and closed magnetic circuit, applied in the direction of inductance with magnetic core, parts of transformer/inductor, transformer/inductor coil/winding/connection, etc., can solve the problem of low coupling coefficient of multi-phase inductance, Achieve the effects of reducing ripple current, improving power efficiency, and increasing saturation current

Active Publication Date: 2021-09-24
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The object of the present invention is to propose a structure of four-phase coupling inductance on a closed magnetic circuit sheet for the problem of low multi-phase inductive coupling coefficient in the background technology

Method used

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  • A Four-phase Coupled Inductor on Chip with Closed Magnetic Circuit
  • A Four-phase Coupled Inductor on Chip with Closed Magnetic Circuit
  • A Four-phase Coupled Inductor on Chip with Closed Magnetic Circuit

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Embodiment

[0029] The four-phase coupled inductor on a closed magnetic circuit chip provided in the embodiment is prepared on a silicon chip through a microfabrication process. The winding is made of metallic copper, with a thickness of 50 μm, a width w of 35 μm, and a coil gap g of 15 μm. The inductor has an extremely low DC resistance of about 61mΩ, which enables the inductor to still have low DC loss under large DC bias. Anisotropic core film width W m =250μm, length L m = 600 μm. The isotropic magnetic core is arc-shaped, R=150μm, closely connected with the anisotropic magnetic core. Material selection of isotropic magnetic core and anisotropic magnetic core [Ni 80 Fe 20 / SiO 2 ] 40 Multi-layer magnetic core film with a thickness of 6μm. The hard-axis magnetic permeability of the anisotropic magnetic core film is 1000, and the magnetic permeability of the isotropic magnetic core film in any direction in the plane is 750.

[0030] The simulation diagram of the inductance valu...

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Abstract

A four-phase coupling inductor on a closed magnetic circuit chip belongs to the technical field of passive integrated devices. The coupled inductor includes isotropic magnetic core, anisotropic magnetic core, four-phase inductance L 1 , L 2 , L 3 , L 4 ; L 1 with L 2 , L 2 with L 3 , L 3 with L 4 , L 4 with L 1 , each half of the windings are cross-wound, that is, half of the magnetic circuits overlap each other to form a negative coupling; L 1 with L 3 The magnetic circuit of the magnetic circuit is adjacent to the two points of the core C and D to form a positive coupling; an isotropic magnetic core film is used in the AB section and the EF section of the magnetic core to form a rectangular or elliptical closed magnetic circuit structure, and make L 2 with L 4 There is a neighbor between the AB section and the EF section of the magnetic circuit, so that L 2 with L 4 A positive coupling is formed. Utilizing the positive and negative coupling formed between phases, the saturation current of the inductor can be increased, the ripple current of the switching power supply can be reduced, and the power efficiency can be improved.

Description

technical field [0001] The invention belongs to the technical field of passive integrated devices, and in particular relates to a four-phase coupling inductor on a closed magnetic circuit chip. Background technique [0002] With the continuous increase in the number of CPU and GPU cores and the wide application of 3D packaging technology, the integration of chips has been further improved, and the problem of heat generation has become more and more serious. Multi-core chips require on-chip power systems with high efficiency to reduce power loss. Inductive DC-DC converters have the characteristics of high working efficiency, high transient response, high output current, and high voltage accuracy. In order to enable the power supply system to provide a large enough output current while saving the area on the chip, the multi-phase power supply design using the Interleave topology has become the main technical means. In addition, the multi-phase power supply design can also us...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F17/04H01F27/245H01F27/28
CPCH01F17/04H01F27/245H01F27/2847
Inventor 白飞明何禹含钟智勇张怀武
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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