Positioning dispensing device for electronic component processing

A technology of electronic components and positioning points, which is applied to the device and coating of the surface coating liquid, which can solve the problems of increasing the labor intensity of the staff and affecting the quality of work, and achieve the effect of convenient dispensing operation

Inactive Publication Date: 2021-03-12
西安米克植意信息科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the staff manually dispensing glue in the prior art. Once the workload is large, the lab

Method used

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  • Positioning dispensing device for electronic component processing
  • Positioning dispensing device for electronic component processing

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Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0020] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.

[0021] refer to Figure ...

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Abstract

The invention relates to the technical field of electronic component processing, and discloses a positioning dispensing device for electronic component processing. The positioning dispensing device for electronic component processing comprises a bottom plate and a dispenser, a supporting plate is fixedly arranged on the left side of the upper surface of the bottom plate, a mounting plate is fixedly arranged on the right side of the upper end of the supporting plate, and a workbench is arranged on the right side of the upper surface of the bottom plate. A lifting mechanism is fixedly arranged on the left side of the workbench, first mounting blocks are symmetrically and fixedly arranged on the lower surface of the mounting plate and the two sides of the upper end of a piston rod of the dispenser, and the interiors of the two first mounting blocks are fixedly connected with the lower surface of the mounting plate through first fastening bolts correspondingly. A first one-way valve and asecond one-way valve are fixedly arranged on the right side wall and the lower surface of a sleeve of the dispenser correspondingly, and two fixing plates are symmetrically and fixedly arranged on theouter wall of the sleeve of the dispenser. According to the positioning dispensing device for electronic component processing, automatic dispensing is achieved, and the working intensity of workers is reduced.

Description

technical field [0001] The invention relates to the technical field of processing electronic components, in particular to a positioning dispensing device for processing electronic components. Background technique [0002] Electronic components are components of electronic components and small machines and instruments. They are often composed of several parts and can be used in similar products; they often refer to certain parts in industries such as electrical appliances, radios, and instruments. They are capacitors, transistors, The general term for electronic devices such as hairsprings and springs. [0003] The traditional glue dispensing process for processing electronic components is usually manually operated by the staff, which leads to the problem that the labor intensity of the staff increases and the work efficiency is low during the glue dispensing process. Contents of the invention [0004] The purpose of the present invention is to solve the problem that the s...

Claims

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Application Information

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IPC IPC(8): B05C5/02B05C13/02
CPCB05C5/0208B05C13/02
Inventor 刘鹏
Owner 西安米克植意信息科技有限公司
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