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Backside illuminated sensor pixel structure

An image sensor and backside technology, applied in the field of image sensors that reduce optical crosstalk, can solve problems such as image sensor accuracy or applicability limitations

Pending Publication Date: 2021-03-19
OMNIVISION TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the accuracy or range of applicability of the image sensor may be limited

Method used

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  • Backside illuminated sensor pixel structure
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Embodiment Construction

[0015] Image sensors, and in particular, image sensors having reduced sensitivity to optical noise are disclosed. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. One skilled in the relevant art will recognize, however, that the techniques described herein may be practiced without one or more of these specific details or may be practiced using other methods, components, materials, etc. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring certain aspects.

[0016] Reference throughout this specification to "one example" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the example is included in at least one example of the present invention. Thus, appearances of the phrases "in one instance" or "in one embodiment" in various places throughout this specification do...

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Abstract

Backside illuminated sensor pixel structure. In one embodiment, an image sensor includes a plurality of photodiodes arranged in rows and columns of a pixel array that are disposed in a semiconductor substrate. Individual photodiodes of the pixel array are configured to receive incoming light through a backside of the semiconductor substrate. The individual photodiodes have a diffusion region formed in an epitaxial region and a plurality of storage nodes (SGs) that are disposed on the front side of the semiconductor substrate and formed in the epitaxial region. An opaque isolation layer havinga plurality of opaque isolation elements is disposed proximate to the front side of the semiconductor substrate and proximate to the diffusion region of the plurality of photodiodes. The opaque isolation elements are configured to block a path of incoming light from the backside of the semiconductor substrate toward the storage nodes.

Description

technical field [0001] The present disclosure relates generally to the design of image sensors, and in particular to image sensors that reduce optical crosstalk. Background technique [0002] Image sensors have become ubiquitous. It is widely used in digital still cameras, cellular phones, security cameras, as well as in medical, automotive and other applications. The technology used to make image sensors continues to make strides. For example, the need for higher image sensor resolution and lower power consumption motivates further miniaturization and integration of image sensors into digital devices. [0003] As the resolution of image sensors increases, the pitch between photodiodes typically decreases, resulting in narrower and deeper photodiodes. These more closely packed photodiodes are more susceptible to optical noise caused by stray light. For example, after illuminating a target photodiode, incoming light may be reflected towards neighboring photodiodes, thus i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146
CPCH01L27/14609H01L27/1464H01L27/14632H01L27/14643H01L27/14687H01L27/14621H01L27/14623H01L27/14689H01L27/14614H01L27/14627H01L27/14685H01L27/14612
Inventor 陈刚王勤
Owner OMNIVISION TECH INC
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