Multi-layer flexible circuit board and preparation method thereof
A technology of flexible circuit boards and circuit substrates, which is applied in the direction of multi-layer circuit manufacturing, printed circuits, circuit devices, etc., can solve the problems of inaccurate alignment of each layer of circuits, different degrees of expansion and contraction, and long periods, and achieves simplified multi-layer circuits. The effect of flexible circuit board process
Active Publication Date: 2021-03-26
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
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- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, the traditional manufacturing process is complicated and the cycle is long
Moreover, laser opening is easy to cause the adhesive layer near the through hole to be pulled, and the degree of expansion and contraction of each layer of substrate after different processes may be different, resulting in the inability to accurately align the lines of each layer
Method used
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[0056] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0057] see Figure 1 to Figure 12 A preferred embodiment of the present invention provides a method for preparing a multilayer flexible circuit board. According to different requirements, the order of steps in the method can be changed, and some steps can be omitted or combined. Described preparation method comprises the steps:
[0058] Step S1, see figure 1 , providing a single-sided copper-clad laminate 10 , the single-sided copper-clad laminate 10 includes an insulating substrate 11 and a copper foil layer 12 formed on the insulating substrate 11 .
[0059] In this embodiment, the material of the insulating substrate 11 can be selected from epoxy resin (epoxy resin), polypropylene (polypropylene, PP), BT resin, polyphenylene oxide (Polyphenylene oxide, PPO), polypropylene (polypropylene , PP), polyimide (polyimide, PI), polyethylene terephthalate ...
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The invention provides a multi-layer flexible circuit board capable of simplifying the manufacturing process and avoiding tapping and adhesive tearing and a manufacturing method of the circuit board.The multi-layer flexible circuit board comprises a plurality of stacked first circuit units, a plurality of bending areas, and at least one first adhesive layer; each first circuit unit comprises twofirst insulating layers, two conductive circuit layers and a first adhesive layer, wherein the two conductive circuit layers and the first adhesive layer are located between the two first insulating layers, and the first adhesive layer wraps the conductive circuit layers; the bending areas are connected with the first circuit unit; the at least one first adhesive layer is used for connecting different first circuit units; each conductive circuit layer comprises a plurality of connecting pads, the connecting pads of the two conductive circuit layers in each first circuit unit are electrically connected through a conductive block, each bending area is internally provided with at least one conduction pad, and the conduction pads are used for electrically connecting the conductive circuit layers of the two adjacent first circuit units.
Description
technical field [0001] The invention relates to the field of circuit boards, in particular to a multilayer flexible circuit board and a preparation method of the multilayer flexible circuit board. Background technique [0002] The manufacturing process of traditional multilayer circuit boards usually includes: pressing copper clad laminates on the inner circuit substrate, laser opening through holes, metallization in the through holes, etching copper clad laminates by exposure and development to form conductive lines, laminating cover film , Open the cover and other steps. However, the traditional manufacturing process is complicated and the cycle is long. Moreover, laser opening is likely to cause tearing of the adhesive layer near the through hole, and the degree of expansion and contraction of each layer of substrate may be different after different manufacturing processes, resulting in the inability to accurately align the lines of each layer. Contents of the inventio...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K3/46H05K1/02H05K1/11
CPCH05K3/46H05K1/0256H05K1/0298H05K1/111H05K1/118
Inventor 李成佳杨梅
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD