Multilayer flexible circuit board and its preparation method
A technology of flexible circuit boards and circuit substrates, which is applied in the direction of multilayer circuit manufacturing, circuit devices, printed circuits, etc., can solve the problems of inaccurate alignment, different degrees of expansion and contraction, and long cycle of each layer of circuits, and achieve simplified multilayer The effect of the flexible circuit board process
Active Publication Date: 2022-04-15
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
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- Description
- Claims
- Application Information
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Problems solved by technology
However, the traditional manufacturing process is complicated and the cycle is long
Moreover, laser opening is easy to cause the adhesive layer near the through hole to be pulled, and the degree of expansion and contraction of each layer of substrate after different processes may be different, resulting in the inability to accurately align the lines of each layer
Method used
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[0056] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0057] see Figure 1 to Figure 12 A preferred embodiment of the present invention provides a method for preparing a multilayer flexible circuit board. According to different requirements, the order of steps in the method can be changed, and some steps can be omitted or combined. Described preparation method comprises the steps:
[0058] Step S1, see figure 1 , providing a single-sided copper-clad laminate 10 , the single-sided copper-clad laminate 10 includes an insulating substrate 11 and a copper foil layer 12 formed on the insulating substrate 11 .
[0059] In this embodiment, the material of the insulating substrate 11 can be selected from epoxy resin (epoxy resin), polypropylene (polypropylene, PP), BT resin, polyphenylene oxide (Polyphenylene oxide, PPO), polypropylene (polypropylene , PP), polyimide (polyimide, PI), polyethylene terephthalate ...
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The present invention provides a multi-layer flexible circuit board capable of simplifying the manufacturing process and avoiding glue tearing and a preparation method thereof. The multi-layer flexible circuit board includes: a plurality of stacked first line units, each of the first The circuit unit includes two first insulating layers, two conductive circuit layers and a first adhesive layer between the two first insulating layers, and the first adhesive layer covers the conductive circuit layer; a plurality of a bending area, the bending area is connected to the first circuit unit; at least one first adhesive layer is used to connect different first circuit units; wherein, each of the conductive circuit layers includes a plurality of connection pads, The connecting pads of the two conductive circuit layers in each of the first circuit units are electrically connected through a conductive block, and at least one conducting pad is provided in each of the bending regions, and the conducting pad The conductive circuit layer is used to electrically connect two adjacent first circuit units.
Description
technical field [0001] The invention relates to the field of circuit boards, in particular to a multilayer flexible circuit board and a preparation method of the multilayer flexible circuit board. Background technique [0002] The manufacturing process of traditional multilayer circuit boards usually includes: pressing copper clad laminates on the inner circuit substrate, laser opening through holes, metallization in the through holes, etching copper clad laminates by exposure and development to form conductive lines, laminating cover film , Open the cover and other steps. However, the traditional manufacturing process is complicated and the cycle is long. Moreover, laser opening is likely to cause tearing of the adhesive layer near the through hole, and the degree of expansion and contraction of each layer of substrate may be different after different manufacturing processes, resulting in the inability to accurately align the lines of each layer. Contents of the inventio...
Claims
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IPC IPC(8): H05K3/46H05K1/02H05K1/11
CPCH05K3/46H05K1/0256H05K1/0298H05K1/111H05K1/118
Inventor 李成佳杨梅
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD