An LED encapsulation glue filling device

Abstract

The invention relates to the related field of LED packaging, and discloses a glue filling device for LED packaging. The lower side of the through cavity of the mold seat is connected with a curing chamber, the upper side of the glue filling cavity is connected with a glue filling needle seat cavity, the upper side of the glue filling needle seat cavity is connected with a push block cavity, and the right side of the push block cavity is connected with a sliding straight hole. In the gear cavity, when the glue filling needle moves down to the upper side of the mold, the slider touches the glue filling sensor block, so that multiple glue filling needles can automatically fill the mold with glue, ensuring that multiple LED package glue can be completed at one time , instead of manually pouring glue one by one, greatly improving the efficiency of glue pouring, and at the same time, the mold base of the lamp cap drives the lamp frame to move vertically downward into the curing chamber, so that the LED lamp can be cured immediately after the glue is poured, avoiding the The light-emitting chip deviates from the center position due to shaking during the movement of the lamp holder, which ensures the quality of the LED lamp packaging glue filling.

Description

technical field [0001] The invention relates to the related field of LED packaging, in particular to a glue filling device for LED packaging. Background technique [0002] LED packaging is filled with glue, the chip and the bracket are wrapped with glue, and then cured. At present, the glue filling process is mainly to manually fill the molds one by one. Since the LED is generally small, the lamp cap mold is also small, so that The glue filling operation requires a high degree of concentration of the operator, and the operation must be very careful, which makes the labor intensity of the operator high and the glue filling efficiency low. Due to shaking, the chip will deviate from the center position in the resin, thereby reducing the LED luminous effect. The thicker side of the resin is weaker, and the opposite is true for the thinner side. Contents of the invention [0003] The object of the present invention is to provide an LED encapsulation glue filling device, which ...

AI Technical Summary

Problems solved by technology

[0002] LED packaging is filled with glue, and the chip and the bracket are wrapped with glue, and then cured. At present, the glue filling process is mainly to manually fill the molds one by one. Since LEDs are generally relatively small, the lamp cap mold is correspondingly small, so that The glue filling operation requires a high degree of concentration of the operator, and the operation must be very careful, which makes the labor intensity of the operator high and the glue filling efficiency low. Due to the shaking, the chip is deviated from the center position in the resin, thereby reducing the LED luminous effect. The thicker side of the resin is weaker, and the opposite is true for the thinner side of the resin.

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