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Assembly method of conductive slip ring assembly

A conductive slip ring and assembly method technology, which is applied in slip ring manufacturing and other directions, can solve the problems that product reliability and qualification rate cannot be effectively guaranteed, and the assembly accuracy of miniaturized products cannot be effectively controlled, etc., to achieve compact structure and strict glue filling method , small size effect

Active Publication Date: 2017-01-04
BEIJING INST OF AEROSPACE CONTROL DEVICES
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AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide an assembly method of a conductive slip ring assembly, which overcomes the problems in the prior art that the assembly accuracy of miniaturized products cannot be effectively controlled, and product reliability and pass rate cannot be effectively guaranteed

Method used

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  • Assembly method of conductive slip ring assembly
  • Assembly method of conductive slip ring assembly
  • Assembly method of conductive slip ring assembly

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Embodiment Construction

[0029] The present invention comprises the following steps:

[0030] 1. After the small journal 1 is assembled and cleaned, the special two-component insulating epoxy adhesive 2 is poured to form the small journal component glue filling. After machining, the small journal assembly is formed.

[0031] 2. Weld the conductive slip ring piece 4 to lead out the wire 5 to form a slip ring assembly.

[0032] 3. First install a piece of insulating gasket 3 on the small journal assembly, and then stack the slip ring assembly and insulating gasket 3 sequentially in a way that a slip ring assembly and a piece of insulating gasket 3 form a group, and assemble 28 groups in total. Finally, after a piece of insulating spacer 3 is installed, the large journal 6 is pressed into it to form a conductive slip ring assembly blank.

[0033] 4. Vacuum infuse the conductive slip ring assembly blank with the special small conductive rod epoxy potting glue 7 (model KMT-206) to form a conductive slip ...

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Abstract

A method for assembling a conductive slip ring assembly, comprising: Step 1, applying an insulating epoxy adhesive to the surface of a small journal, and then machining the small journal to form a small journal assembly; Step 2, applying the conductive slip ring piece Welding with lead wires to form a slip ring assembly; step 3, install multiple sets of insulating gaskets and slip ring assemblies alternately arranged on the small journal assembly; step 4, press-fit the large journal on the small journal assembly to form a conductive Slip ring assembly blanks; step 5, vacuum infuse the conductive slip ring assembly blanks with epoxy potting glue to form a conductive slip ring assembly. The invention achieves the insulation effect between the shaft and the slip ring piece by pouring two-component insulating epoxy adhesive glue into the small journal, and has small size and compact structure.

Description

technical field [0001] The invention relates to the field of inertial instrument components, in particular to an assembly method for small size and compact structure conductive slip ring components. Background technique [0002] The gyro accelerometer outer ring power transmission device in the inertial instrument can realize the power and signal transmission between the gyro pendulum and the outer ring. The power transmission device is composed of three parts: a conductive slip ring assembly, a brush assembly and a bracket. Among them, the assembly quality of the conductive slip ring assembly directly affects the performance of the power transmission device. Due to the volume requirements of special instruments, the conductive slip ring assembly has the characteristics of small size, compact structure and many working channels. Therefore, how to assemble a miniaturized conductive slip ring assembly that requires high precision becomes the key. [0003] The general assemb...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R43/10
Inventor 李宇梅陈小勇张福礼郑涛张学渊张佐王林李伟
Owner BEIJING INST OF AEROSPACE CONTROL DEVICES
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