A kind of manipulator and method for carrying wafer in cmp cleaning unit

Abstract

The invention discloses a manipulator and a method for transporting wafers in a CMP cleaning unit, including an X-axis slide rail arranged above or below the cleaning unit, at least one Z-axis slide rail, and a slider arranged on the Z-axis slide rail The pick-up device, the Z-axis slide rail is set on the slider of the X-axis slide rail to move horizontally. The slide rail slider drives the Z-axis slide rail to move horizontally, and the Z-axis slide rail slider drives the handling device to move in the vertical direction, so that the pick-up device on the Z-axis slide rail slider can carry the wafer in the cleaning mechanism of the cleaning unit. And the wafer is turned over by the rotation function of the handling device, and the wafer is placed in the drying mechanism. Compared with the prior art, the method of directly grabbing the wafer by the manipulator for handling and turning has higher handling stability. .

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a manipulator and a method for transporting wafers in a CMP cleaning unit. Background technique [0002] In the wafer cleaning process of wafer chemical mechanical planarization equipment, the current mainstream cleaning method is tank cleaning, and the polished wafers will be placed vertically in one or more tanks filled with chemicals At the same time, it is cleaned with ultrasonic cleaning, brushing and other processes. The last process is usually a drying process, and the wafer is usually dried by horizontal rotation. Therefore, it is necessary to design a manipulator for transferring wafers in each process. [0003] The existing manipulator includes two pick-up devices. During ultrasonic cleaning, scrubbing and other processes, the wafer pick-up device alternately cycles to pick up wafers. Both pick-up devices participate in the pick-up and placement of w...

AI Technical Summary

Problems solved by technology

[0003] The existing manipulator includes two pick-up devices. In ultrasonic cleaning, brushing and other processes, the wafer pick-up device alternately cycles to pick up wafers. Both pick-up devices participate in the pick-up and placement of wafers in each cleaning tank. However, Traditional manipulators only have two degrees of freedom in the X-axis and Z-axis directions, and the grasped wafers cannot be flipped. Therefore, there are requirements for the placement of the wafers in the cleaning process, which must be at the same angle. The circle picking action is generally completed by the opening and closing mechanism installed on the top of the pick-up device. The movement of this opening and closing mechanism is above the wafer, and the particle pollution generated by the movement may fall on the wafer, which will affect the effect of the wafer cleaning process. risk, and each opening and closing action will inevitably cause a slight shake of the pick-up device, which may cause the clamping action to fail. The traditional wafer pick-up device works alternately and cyclically, which will cause cleaning fluid or impurities to remain on the two manipulators. Wafer cleanliness is compromised before entering the spin dry area

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