Unlock instant, AI-driven research and patent intelligence for your innovation.

Liquid supply device

A liquid supply and liquid treatment technology, which is applied in the field of liquid supply devices, can solve the problems of short service life of pumps, achieve the effects of prolonging service life, reducing manufacturing costs, and reducing damage

Active Publication Date: 2021-12-17
YANGTZE MEMORY TECH CO LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a liquid supply device, which is used to solve the problem of short service life of pumps in existing semiconductor manufacturing equipment, so as to reduce semiconductor manufacturing costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Liquid supply device
  • Liquid supply device
  • Liquid supply device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The specific implementation of the liquid supply device provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0030] In the process of semiconductor manufacturing, the liquid supply device is used to provide processing liquid to the processing machine. Currently, an air valve and a throttle valve are arranged in the internal circulation pipeline of the liquid supply device, and the flow rate of the processing liquid in the internal circulation pipeline is adjusted jointly by the throttle valve and the air valve. When the processing machine is in an idle state, the air valve is opened to reduce the flow rate of the processing liquid in the liquid supply pipeline communicated with the processing machine; when the processing machine is in an operating state, the air valve is closed to increase The flow rate of the processing liquid in the liquid supply pipeline ensures the smooth progress of the semiconductor m...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a liquid supply device. The liquid supply device includes: a liquid storage tank for storing the treatment liquid; a first pipeline, the input end of the first pipeline is connected to the output end of the liquid storage tank; a second pipeline, the input end of the second pipeline The output end of the first pipeline is connected to the output end of the second pipeline, and the output end of the second pipeline is connected to the input end of the liquid storage tank for internal circulation of the treatment liquid in the liquid storage tank; the third pipeline, the The input end of the third pipeline is connected to the output end of the first pipeline, and the output end of the third pipeline is connected to a processing pump, and the processing pump pumps the processing liquid to the processing machine, and the third pipeline The flow rate of the processing liquid in the process is the same when the processing machine is in the running state and when the processing machine is in the idle state. In the present invention, during the state switching process of the processing machine, the loading of the processing pump does not require frequent switching, which reduces damage to the processing pump and prolongs the service life of the pump.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a liquid supply device. Background technique [0002] With the development of planar flash memory, the production process of semiconductors has made great progress. However, in recent years, the development of planar flash memory has encountered various challenges: physical limits, existing development technology limits, and storage electron density limits. In this context, in order to solve the difficulties encountered in planar flash memory and pursue lower production costs per unit storage unit, various three-dimensional (3D) flash memory structures have emerged, such as 3D NOR (3D or not) flash memory and 3D NAND (3D NAND) flash memory. [0003] Among them, 3D NAND memory takes its small size and large capacity as the starting point, and the design concept of highly integrated storage units stacked in three-dimensional mode is to produce a memory with hi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L27/11524H01L27/11551H01L27/1157H01L27/11578F17D1/14F17D3/01
CPCH01L21/6715H01L21/6704H01L21/67075F17D1/14F17D3/01H10B41/35H10B41/20H10B43/35H10B43/20
Inventor 刘旭华李剑张宏权
Owner YANGTZE MEMORY TECH CO LTD