Package structure and method for manufacturing the same
A technology of packaging structure and packaging body, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., and can solve problems such as open-circuit semiconductor packaging structure, fracture, and failure to operate
Pending Publication Date: 2021-05-25
ADVANCED SEMICON ENG INC
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- Description
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- Application Information
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Problems solved by technology
If the crack reaches the substrate, parts of the circuit in the substrate can be damaged or broken, which can lead to an open circuit and make the semiconductor package structure inoperable
Therefore, the yield of the semiconductor assembly structure may decrease
Method used
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[0059]The same or similar components are shown in detail throughout the drawings and detailed description. Embodiments of the present disclosure will be readily understood from the following detailed description of the accompanying drawings.
[0060]A number of different embodiments or examples of different features of the provided topics are disclosed below. Specific examples of components and arrangements are described below to explain certain aspects of the disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, a first feature may be formed above or above or over the second feature may include an embodiment in which the first features and the second feature are directly in contact, and may also include in the first feature and the first feature. The additional feature of the second feature is formed, so that the first feature and the second feature may not be directly in direct contact. Moreover, the present d...
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The invention relates to a package structure and a method for manufacturing the same. The package structure includes a wiring structure, a first electronic device, a second electronic device, a protection material and a reinforcement structure. The first electronic device and the second electronic device are electrically connected to the wiring structure. The protection material is disposed between the first electronic device and the wiring structure and between the second electronic device and the wiring structure. The reinforcement structure is disposed on and contacts the first electronic device and the second electronic device. The reinforcement structure contacts the protection material.
Description
Technical field[0001]The present disclosure relates to a packaging structure and a method of manufacturing, and relates to a package structure comprising a reinforcing structure and a method for manufacturing the package structure.Background technique[0002]In the semiconductor assembly structure, the semiconductor package is mounted to the substrate, and the heat sink is attached to the upper surface of the semiconductor package structure to dissipate one or more semiconductor devices in the semiconductor package during operation. However, when the heat sink is attached to the semiconductor package structure, the pressure may be transmitted from the heat sink to the semiconductor package structure. Since the hardness or stiffness of the semiconductor package structure is relatively low, cracks may be formed at the upper surface of the semiconductor package structure. Further, during the manufacturing process, a plurality of thermal processes (e.g., reflow processes) can be performed...
Claims
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IPC IPC(8): H01L23/16H01L23/367H01L23/373H01L25/065H01L25/16H01L21/56
CPCH01L23/16H01L23/367H01L23/3736H01L25/0652H01L25/16H01L21/56H01L21/568H01L23/562H01L23/3135H01L23/3128H01L21/563H01L21/6835H01L2221/68345H01L2221/6834H01L2221/68327H01L25/18H01L25/03H01L23/36H01L23/49816H01L23/5383H01L23/5389H01L23/3675H01L23/14H01L23/42H01L2224/73204H01L2224/16225H01L2224/32225H01L2924/15311H01L2924/00H01L25/50
Inventor 方绪南叶勇谊
Owner ADVANCED SEMICON ENG INC