A method for preparing superhydrophobic surfaces by combining femtosecond laser direct writing and electroplating
A super-hydrophobic surface, femtosecond laser technology, applied in laser welding equipment, nanotechnology for materials and surface science, manufacturing tools, etc., can solve the problems of high cost and a lot of time, and achieve efficient and convenient manufacturing process. Effect of gradient flow and self-cleaning
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[0023] A method for preparing a super-hydrophobic surface by combining femtosecond laser direct writing and electroplating. The metal layer is a 45nm gold film, the substrate is a silicon wafer with a thickness of 1mm, and the electroplating metal is copper as an example. Its manufacturing steps are as follows:
[0024] Step 1: select the method of electron beam evaporation plating to coat a layer of gold film of 45nm (such as figure 2 (a));
[0025] Step 2: Build as figure 1 In the femtosecond laser processing system shown, the focusing lens is a 100-fold plano-convex objective lens;
[0026] Step 3: Controlled by a computer program, use a femtosecond laser to perform patterned direct-writing processing on the gold film obtained in step 1 to manufacture gold micron wire electrodes (such as figure 2 (b));
[0027] Step 4: Use the gold micron wire electrode prepared in Step 3 as the electroplating cathode, and place it in a CuSO 4 Electroplating is carried out in an elec...
example 2
[0035] Such as image 3Shown is the gold micron wire electrode processed through the processing procedures shown in Steps 1, 2, and 3 of Example 1. Among them, the control laser energy is 0.9mW, the scanning speed is 700μm / s, and the scanning line spacing is 40μm. The width of the processed electrode is about 17μm. Take the typical gold micron wire electrode processed by this as an example, image 3 As shown by the scanning electron microscope of , the black part is the exposed silicon substrate below after removing the gold film in this part by femtosecond laser scanning. The white part is the gold micro-wire left on the substrate without femtosecond laser processing, which is used as a micro-wire electrode with better conductivity. By controlling the laser energy, scanning speed and scanning line spacing parameters during the scanning process, the width of the gold micro-wire electrode can be controlled. In the subsequent electroplating process, since the black part is th...
example 3
[0037] Such as Figure 4 As shown, it is the result of using the 17 μm gold micro-wire electrode processed in Example 2, and then performing the copper electroplating treatment in Step 4 of Example 1. By controlling the same energization time of 30s, the current density is 0.33A / dm 2 (Such as Figure 4 (a) shown), 0.66A / dm 2 (Such as Figure 4 (b) shown), 0.99A / dm 2 (Such as Figure 4 (c) shown), 1.32A / dm 2 (Such as Figure 4 Shown in (d) ), thus obtaining the scanning electron microscope pictures of copper particles with different shapes and sizes plated on the gold micron wire electrodes. The scale bar in the figure is 2 μm.
[0038] It can be seen that the morphology, size and distribution of copper particles generated by electroplating can be flexibly adjusted by adjusting the parameters of the electroplating process.
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