Manufacturing method of flexible copper clad laminate
A technology of flexible copper clad laminates and manufacturing methods, which is applied in the fields of printed circuit manufacturing, printed circuit precursor manufacturing, printed circuits, etc., and can solve the problems of flexible copper clad laminates unfolding, damage to the surface of copper foil of flexible copper clad laminates, and easy Adhesion and other problems occur, to achieve the effect of avoiding adhesion
Active Publication Date: 2022-03-11
江西卓讯微电子有限公司
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Problems solved by technology
However, in the process of using RTR technology to produce double-sided flexible copper clad laminates, when the surface of the copper foil of the flexible copper clad laminate is smooth, the two smooth copper foil surfaces are prone to adhesion during the winding process, making it difficult to wrap the flexible copper clad laminate. The copper plate spreads, and even damages the surface of the copper foil of the flexible copper clad laminate, reducing the performance of the flexible copper clad laminate
Method used
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[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.
[0025] The present invention provides a method for manufacturing a flexible copper clad laminate, please refer to Figure 1 to Figure 3 , in one embodiment, the manufacturing method includes:
[0026] S1: Form the first copper layer 21 and the second copper layer 22 on the two opposite surfaces of the substrate 10 respectively.
[0027] S2: Forming a first roughened film layer 31 on the surface of the first copper layer 21...
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Abstract
The invention provides a method for manufacturing a flexible copper-clad laminate. The method includes forming a first copper layer and a second copper layer on two opposite surfaces of a substrate; forming a first copper layer on the surface of the first copper layer facing away from the substrate. A roughened film layer, and / or forming a second roughened film layer on the surface of the second copper layer facing away from the substrate; winding the flexible copper clad laminate. Wherein, the surface roughness of the first roughened film layer is greater than the surface roughness of the first copper layer, the surface roughness of the second roughened film layer is greater than the surface roughness of the second copper layer, and the first roughened film layer and The surface roughness of the second roughened film layer is greater than the roughness threshold value of adhesion between the first copper layer and the second copper layer. By plating a roughened film layer on the copper layer and controlling the roughness of the roughened film layer, in the roll-to-roll production process, it is possible to avoid the occurrence of sticking when the surface of the first copper layer and the second copper layer are bonded The phenomenon of protecting the copper foil surface of the flexible copper clad laminate from damage.
Description
technical field [0001] The invention relates to the technical field of flexible copper clad laminates, in particular to a method for manufacturing flexible copper clad laminates. Background technique [0002] FCCL (Flexible Copper Clad Laminate, flexible copper clad laminate) has the characteristics of thinness, lightness and flexibility. FPC (Flexible Printed Circuit, flexible circuit board) using FCCL as the substrate material is widely used in mobile phones, digital cameras, digital video cameras , Car satellite direction positioning devices, LCD TVs, notebook computers and other electronic products. In particular, the demand and growth trend of high-performance flexible copper-clad laminates based on PI (Polyimide, polyimide) films are more prominent. [0003] RTR (Roll-to-Roll, roll-to-roll) technology uses flexible copper-clad laminates to make FPCs in continuous rolls, which is conducive to the realization of automatic continuous production of FPCs and continuous sur...
Claims
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IPC IPC(8): H05K3/02
CPCH05K3/022
Inventor 余飞
Owner 江西卓讯微电子有限公司