Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Server heat dissipation device and server heat dissipation method

A technology of cooling device and server, applied in the server field, can solve the problems of reducing the life of the system, strengthening the scouring and damage of the server node by the refrigerant, and achieving the effect of saving energy, independent and controllable heat dissipation, and reducing the flow of refrigerant

Pending Publication Date: 2021-06-15
SHANDONG YINGXIN COMP TECH CO LTD
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the water tank of the existing submerged liquid cooling system is fixed for each flow control hole, which is usually pre-designed according to the power consumption of the existing server nodes, and the flow of each server node is guaranteed to be consistent as much as possible. However, in actual operation and maintenance In general, it is impossible to install the same type of server nodes in a Tank. Usually, the temperature of a certain server node is too high to control the flow of the entire Tank to increase. The increase in flow will strengthen the erosion of the refrigerant to the server node and reduce the system life, so it is urgent to improve

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Server heat dissipation device and server heat dissipation method
  • Server heat dissipation device and server heat dissipation method
  • Server heat dissipation device and server heat dissipation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] In order to make the object, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0042] It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are to distinguish two entities with the same name but different parameters or parameters that are not the same, see "first" and "second" It is only for the convenience of expression, and should not be construed as a limitation on the embodiments of the present invention, which will not be described one by one in the subsequent embodiments.

[0043] In one embodiment, combine figure 1 , figure 2 and image 3 As shown, the present invention provides a server cooling device, the device comprising:

[0044] The water tank 1, the water tank 1 includes a liquid inlet 11, a liquid outlet 1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a server heat dissipation device and a server heat dissipation method. The heat dissipation device comprises a water tank, wherein the water tank comprises a liquid inlet, a liquid outlet, a bottom wall and a side wall arranged above the bottom wall, the side wall and the bottom wall jointly form a containing cavity for containing a server, and the containing cavity is provided with a server inlet and outlet; a baffle which is arranged in the containing cavity and divides the containing cavity into a liquid collecting cavity and a server containing cavity, wherein the liquid collecting cavity is communicated with the liquid inlet, the server containing cavity is communicated with the liquid outlet, a plurality of servers are placed in the server containing cavity, and flow guide through holes are formed in the positions, opposite to the servers, of the baffle; and an opening adjusting part which is arranged on at least one flow guide through hole to adjust the opening degree of the flow guide through hole. According to the scheme, the refrigerant flow of the server nodes can be independently controlled to achieve independent and controllable heat dissipation of the server nodes, the heat dissipation effect of each server node is guaranteed while the refrigerant flow is reduced, the heat dissipation efficiency is improved, and energy is saved.

Description

technical field [0001] The invention relates to the technical field of servers, in particular to a server cooling device and a server cooling method. Background technique [0002] With the development of new technologies such as cloud computing and big data, the requirements for storage and calculation of data calculation are getting higher and higher, the storage density of stand-alone systems is getting higher and higher, and the power consumption is getting higher and higher. It is a crucial issue at present, and the society has higher and higher requirements on system power consumption, and energy saving is also a mainstream trend at present. The immersion liquid cooling heat dissipation is to input the refrigerant into the entire tank (Tank), and the refrigerant circulates to take away the heat of the server node, so as to meet the heat dissipation requirements of its various components. [0003] However, the water tank of the existing submerged liquid cooling system i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201
Inventor 宗斌
Owner SHANDONG YINGXIN COMP TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com