A composite material for 5g antenna

A composite material and 5G technology, applied in the direction of circuit substrate material, radiation element structure, printed circuit components, etc., can solve the problem of high loss of polyimide, and achieve the effect of improving the stability of use and the peel strength

A composite material and 5G technology, applied in the direction of circuit substrate material, radiation element structure, printed circuit components, etc., can solve the problem of high loss of polyimide, and achieve the effect of improving the stability of use and the peel strength

CN113099608BActive Publication Date: 2022-07-15深圳市华盈新材料有限公司

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  • A composite material for 5g antenna
  • A composite material for 5g antenna
  • A composite material for 5g antenna

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] The embodiments of the present invention will be further described below with reference to specific examples, and those who are familiar with the technology can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0034] Before further describing the specific embodiments of the present invention, it should be understood that the protection scope of the present invention includes but is not limited to the following specific specific embodiments. Generally, the terms used in the embodiments of the present invention are for describing specific specific embodiments, rather than for limiting the protection scope of the present invention. The test methods without specific conditions in the following examples are usually in accordance with conventional conditions, or in accordance with the conditions suggested by various manufacturers.

[0035] When numerical ranges are given in the examples, it is to be u...

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PUM

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Abstract

The invention provides a composite material for a 5G antenna, comprising an LCP film layer and a copper foil layer, wherein the LCP film layer uses 2,6-naphthalenedicarboxylic acid and bis(4-phenol group)-1,2-acetylene as functional monomers body with extremely low dielectric constant, dielectric loss and thermal expansion coefficient. At the same time, with 3,4-dicyanophenol, the cyano group in its structure can improve the adhesion performance of LCP material and copper foil, and improve the stability of use, but excessive amount will affect the dielectric properties due to polarity. At the same time, the LCP polymer of the present invention also includes p-hydroxybenzoic acid, which can reduce the composition within a certain range and improve the acceptability of the material.

Description

technical field [0001] The invention relates to the field of composite materials for a new generation of communication technologies, in particular to a composite material for 5G antennas. Background technique [0002] LCP is an important material widely used in 5G flexible circuit boards. It has excellent properties such as high heat resistance, low water absorption, low dielectric loss and high dimensional stability, and is an ideal material for millimeter-wave circuits. With the advent of the 5G era, the widely used polyimide antenna materials in the traditional 4G era have been unable to meet the demand. Polyimide has a large loss at the 2.4GHz frequency and cannot be used for frequencies above 10GHz. With its low dielectric constant and low dielectric loss, LCP has gradually replaced polyimide film and has become one of the most important coating materials for flexible circuit boards. The LCP and the soft copper foil substrate are pressed together to form a copper clad ...

Claims

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Application Information

Patent Timeline
15 Jul 2022
Publication
CN113099608B
IPC
H05K1/03; H01Q1/38; C08J5/18; C08L67/06
CPC
H05K1/0353; H01Q1/38; C08J5/18; C08J2367/06
Inventors
贺朋波; 马茂祥