Block bonding and combining equipment capable of accurately positioning, taking and placing lower plate

Abstract

The invention relates to block bonding and combining equipment capable of accurately positioning, taking and placing a lower plate. The equipment comprises a rack; a turntable is arranged on the rack; carriers are uniformly arranged on the turntable; a lower plate discharging device, a film removing device and an upper plate discharging device which are in butt joint with the carriers are sequentially arranged on the rack in the rotating direction of the turntable; the rack is further provided with a lower plate conveying device matched with the lower plate discharging device; the lower plate conveying device comprises a lower plate conveying groove formed in the rack; a lower plate intercepting block is arranged at the tail end of the lower plate conveying groove; a lower plate clamping air cylinder perpendicular to the lower plate conveying groove is arranged on the outer side of the lower plate intercepting block; the lower plate clamping air cylinder is connected with a lower plate clamping movable block; the lower plate clamping movable block is connected with a lower plate clamping connecting rod capable of penetrating into the lower plate conveying groove; the lower plate clamping connecting rod is connected with a lower plate clamping block matched with the lower plate; and the other side wall of the lower plate clamping block and the other side wall of the lower plate conveying groove are both lower than the lower plate in the lower plate conveying groove. The precision control difficulty is reduced.

Description

technical field [0001] The invention relates to the field of assembly equipment, in particular to a block bonding combination equipment capable of accurately positioning and taking out a lower plate. Background technique [0002] Such as image 3 As shown, it is a combination block, including a lower plate 11 and an upper plate 13, and its lower plate 11 and upper plate 13 are adhesively bonded, and the lower plate 11 is as follows before assembly figure 2 As shown, its upper surface is covered with film 12, the film needs to be removed (removed) first, so that its upper surface has a bonding function, and then the upper plate 13 is placed on the lower plate 11. To perform automated assembly, it is necessary to Automatic feeding of the lower board is realized. Most of the existing feeding is a feeding manipulator, which uses multi-axis motion to realize the feeding. However, the multi-axis motion cannot ensure the accuracy of the lower board after discharging, so it will af...

AI Technical Summary

Problems solved by technology

[0002] like image 3 As shown, it is a combination block, including a lower plate 11 and an upper plate 13, and its lower plate 11 and upper plate 13 are adhesively bonded, and the lower plate 11 is as follows before assembly figure 2 As shown, its upper surface is covered with film 12, the film needs to be removed (removed) first, so that its upper surface has a bonding function, and then the upper plate 13 is placed on the lower plate 11. To perform automated assembly, it is necessary to Automatic feeding of the lower board is realized. Most of the existing feeding is a feeding manipulator, which uses multi-axis motion to realize the feeding. However, the multi-axis motion cannot ensure the accuracy of the lower board after discharging, so it will affect the subsequent bonding. Combined accuracy

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