Halogen-free lead-free antioxidant solder paste and preparation method thereof

Abstract

The invention provides halogen-free lead-free antioxidant solder paste. According to the technical scheme, the halogen-free lead-free antioxidant solder paste comprises the following components of, by weight, 2.12% of Ni, 0.51% of Cu, 9.29% of alloy metal, 13.5% of soldering flux and the balance Sn; the soldering flux comprises the following components of, by weight, 84% of a carrier, 6.8% of an activating agent, 4.37% of a surface active agent and 4.83% of a corrosion inhibitor; rosin is one of water-white rosin, hydrogenated rosin and esterified rosin; and the alloy metal comprises 0.14 wt%-1.15 wt% of cobalt, 0.45 wt%-0.55 wt% of antimony, 0.005 wt%-0.15 wt% of germanium, 8.0 wt%-8.8 wt% of bismuth and 0 wt%-0.25 wt% of phosphorus, and the weight ratio of all the elements in the alloy metal is the weight ratio of all the elements in the solder paste. The halogen-free lead-free antioxidant solder paste is good in halogen-free oxidation resistance, the activity and printing durability of the solder paste are improved, the wettability of solder to a base material is improved, and the solder paste has certain collapse resistance.

Description

[0001] This application is a divisional application, the application number of the original application is 201910210562.1, the application date is: March 20, 2019, and the title of the invention is: a lead-free anti-oxidation solder paste and its preparation method. 【Technical field】 [0002] The invention relates to a solder paste material, more specifically to a halogen-free lead-free anti-oxidation solder paste and a preparation method thereof. 【Background technique】 [0003] Welding technology has been developed for more than sixty years, and with the continuous development of science and technology, welding technology has been continuously developed and innovated. As one of the commonly used forms of electronic solder, solder paste is constantly developing and innovating with the advancement of science and technology, the upgrading of industrial manufacturing 4.0 and the country's requirements for accelerating the development of strategic basic new materials. At present,...

AI Technical Summary

Problems solved by technology

[0004] In recent decades, in the soldering process of electronic products, rosin resin flux mainly composed of rosin, resin, halide-containing active agent, additive and organic solvent is generally used. Although this type of flux can be soldered Good performance and low cost, but the residue after soldering is high, and the residue contains halogen ions, which will gradually cause problems such as electrical insulation performance degradation and short circuit. To solve this problem, it is necessary to help the rosin resin system on the electronic printed board Flux residues are cleaned, which will not only increase production costs, but also the cleaning agent for cleaning rosin resin-based flux residues is mainly fluorochlorine compounds, which are substances that deplete the atmospheric ozone layer and are banned and eliminated. Before solder paste printing or injection coating, because the anti-collapse performance of the solder paste is not strong, the solder paste will expand to the predetermined position, that is, the collapse of the solder paste will make the adjacent circuit patterns connected, resulting in short circuit or solder joint displacement , the new solder paste needs to overcome the above defects at the same time

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