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SIP module and FPC connection method and electronic product

A connection method and module technology, applied in the direction of assembling printed circuits with electrical components, can solve problems such as poor welding and poor assembly and assembly of the whole machine, and achieve the effect of preventing separation and ensuring welding yield.

Inactive Publication Date: 2021-10-22
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the above problems, the purpose of the present invention is to provide a method for connecting a SIP module and an FPC and an electronic product, so as to solve problems such as poor welding and poor assembly when the whole machine is assembled in the existing connection mode.

Method used

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  • SIP module and FPC connection method and electronic product
  • SIP module and FPC connection method and electronic product

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Embodiment Construction

[0024] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that these embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.

[0025] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", The orientation or positional relationship indicated by "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying t...

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PUM

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Abstract

The invention provides an SIP module and FPC connection method and an electronic product. The SIP module and the FPC are connected and conducted through an adapter plate. The connection method comprises the following steps: attaching an adapter plate to a preset position of the SIP module, and welding and fixing one side, close to the SIP module, of the adapter plate with the SIP module; carrying out whole-surface dispensing and fixing on the adapter plate and the SIP module which are welded and fixed through a dispensing needle; attaching the FPC to the side, away from the SIP module, of the adapter plate, and fixedly welding the side, close to the FPC, of the adapter plate to the FPC; and subjecting the fixedly welded adapter plate and the FPC to whole-surface dispensing and fixing through a dispensing needle. According to the invention, the welding yield of the SIP module and the FPC and the assembly quality of the product can be improved.

Description

technical field [0001] The invention relates to the technical field of SIP assembly, and more specifically, relates to a connection method between a SIP module and an FPC and an electronic product. Background technique [0002] With the continuous development of the field of smart wearables, the requirements for the size of the whole machine are getting higher and higher, which makes the size of the corresponding SIP module smaller and smaller. At the same time, with the increase of product functions, the size of the SIP module The number of devices is also increasing. In order to ensure that the size meets the requirements and make the functions more complete, some devices will be placed on the FPC, and then the whole solution will be realized by connecting the module and the FPC. At present, the SIP module and the FPC are usually connected by an interposer. There are solder balls on both sides of the interposer, and the connection between the two is realized through the me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH05K3/34
Inventor 高琳王德信柯于洋
Owner QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD