A device for backside grinding of semiconductor wafers

Abstract

The present application provides a device for grinding the back of a semiconductor wafer, belonging to the field of wafer manufacturing, comprising: a running mechanism including a rotatable mounting plate, and the mounting plate has multiple mounting holes. The number of bearing discs is the same as that of the mounting holes, the bearing discs are rotatably arranged in the mounting holes, the bearing discs are provided with a plurality of sink holes along the circumference, and the bottom of the bearing discs is provided with a connecting part. The first driving part is located under the mounting plate, and the first driving part includes a driving pump, and a driving shaft is arranged to move along the axial direction of the rotating shaft of the driving pump. The feeding mechanism includes an alignment table and a suction cup. The grinding mechanism is arranged above the mounting plate corresponding to the first driving component, the grinding mechanism is provided with a grinding plate, and the positions corresponding to the grinding mechanism are provided above and below the mounting plate with sealing covers. It has high safety in use, is convenient for maintenance and inspection, and has high processing efficiency.

Description

technical field [0001] The invention belongs to the technical field of semiconductor wafer processing, and in particular relates to a device for grinding the back of a semiconductor wafer. Background technique [0002] The wafers used for the production of semiconductor devices mainly include crystal molding, shaping, slicing, and grinding. Semiconductor manufacturers need to thin the wafers provided upstream before manufacturing to meet the thickness required for semiconductor product design. At present, the wafers are mainly thinned by grinding. [0003] When polishing, it is necessary to spray the polishing liquid on the wafer. The liquid is not only used to wash and clean the wafer, but also contains additives in the polishing liquid to protect the chemical stability of the wafer. In the existing grinding device, various mechanisms are generally arranged in a sealed box, including various components driven by electricity, such as a motor that drives the rotation of the ...

AI Technical Summary

Problems solved by technology

Equipment with this structure requires special waterproof treatment for various electrical components, resulting in higher costs, and it is also difficult to avoid electrical components being corroded by liquids and causing damage

On the other hand, in the existing grinding equipment, the grinding disc is usually set coaxially with the wafer, and the wafer is polished by relative rotation. This structure can only process one wafer at a time, and the efficiency is low.

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