Device for polishing back face of semiconductor wafer

A semiconductor and wafer technology, applied in the field of semiconductor wafer processing, can solve the problems of increased cost, damage, and low efficiency, and achieve the effects of improving efficiency, avoiding waterproof and easy damage, and facilitating liquid contact

Active Publication Date: 2021-12-03
四川明泰微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Equipment with this structure requires special waterproof treatment for various electrical components, resulting in higher costs, and it is also difficult to avoid electrical components being corroded by liquids and causing damage
On the other hand, in the existing grinding equipment, the grinding disc is usually set coaxially with the wafer, and the wafer is polished by relative rotation. This structure can only process one wafer at a time, and the efficiency is low.

Method used

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  • Device for polishing back face of semiconductor wafer
  • Device for polishing back face of semiconductor wafer
  • Device for polishing back face of semiconductor wafer

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Embodiment Construction

[0041] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, but the embodiments described in the present invention are some of the embodiments of the present invention, not all of them .

[0042] It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

[0043] In describing the present invention, it should be noted that the terms "centre", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. indicate The orientation or positional relationship of the invention is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that is usually p...

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Abstract

The invention provides a device for polishing the back face of a semiconductor wafer, and belongs to the field of wafer manufacturing. The device comprises an operating mechanism, wherein the operating mechanism comprises a rotatable mounting disc, and the mounting disc is provided with a plurality of mounting holes. The number of bearing discs is the same as that of the mounting holes, the bearing discs are rotationally arranged in the mounting holes, a plurality of counter bores are formed in the bearing discs circumferentially, and connecting parts are arranged at the bottoms of the bearing discs. A first driving part is located below the mounting disc and comprises a driving pump, a driving shaft is movably arranged in the axis direction of a rotating shaft of the driving pump, and when the wafer is polished, the driving shaft is connected with the connecting parts of the bearing discs. A feeding mechanism comprises an alignment table and a suction cup. A grinding mechanism is arranged above the mounting disc corresponding to the first driving component, the grinding mechanism is provided with a grinding disc, and sealing covers are arranged at the positions, corresponding to the grinding mechanism, above and below the mounting disc. The device is high in use safety, convenient to maintain and check and high in machining efficiency.

Description

technical field [0001] The invention belongs to the technical field of semiconductor wafer processing, and in particular relates to a device for grinding the back of a semiconductor wafer. Background technique [0002] The wafers used for the production of semiconductor devices mainly include crystal molding, shaping, slicing, and grinding. Semiconductor manufacturers need to thin the wafers provided upstream before manufacturing to meet the thickness required for semiconductor product design. At present, the wafers are mainly thinned by grinding. [0003] When polishing, it is necessary to spray the polishing liquid on the wafer. The liquid is not only used to wash and clean the wafer, but also contains additives in the polishing liquid to protect the chemical stability of the wafer. In the existing grinding device, various mechanisms are generally arranged in a sealed box, including various components driven by electricity, such as a motor that drives the rotation of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B7/22B24B41/06B24B47/12B24B41/00
CPCB24B7/228B24B41/068B24B47/12B24B41/005
Inventor 袁根鲜浩
Owner 四川明泰微电子有限公司
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