Device for polishing back face of semiconductor wafer

Abstract

The invention provides a device for polishing the back face of a semiconductor wafer, and belongs to the field of wafer manufacturing. The device comprises an operating mechanism, wherein the operating mechanism comprises a rotatable mounting disc, and the mounting disc is provided with a plurality of mounting holes. The number of bearing discs is the same as that of the mounting holes, the bearing discs are rotationally arranged in the mounting holes, a plurality of counter bores are formed in the bearing discs circumferentially, and connecting parts are arranged at the bottoms of the bearing discs. A first driving part is located below the mounting disc and comprises a driving pump, a driving shaft is movably arranged in the axis direction of a rotating shaft of the driving pump, and when the wafer is polished, the driving shaft is connected with the connecting parts of the bearing discs. A feeding mechanism comprises an alignment table and a suction cup. A grinding mechanism is arranged above the mounting disc corresponding to the first driving component, the grinding mechanism is provided with a grinding disc, and sealing covers are arranged at the positions, corresponding to the grinding mechanism, above and below the mounting disc. The device is high in use safety, convenient to maintain and check and high in machining efficiency.

Description

technical field [0001] The invention belongs to the technical field of semiconductor wafer processing, and in particular relates to a device for grinding the back of a semiconductor wafer. Background technique [0002] The wafers used for the production of semiconductor devices mainly include crystal molding, shaping, slicing, and grinding. Semiconductor manufacturers need to thin the wafers provided upstream before manufacturing to meet the thickness required for semiconductor product design. At present, the wafers are mainly thinned by grinding. [0003] When polishing, it is necessary to spray the polishing liquid on the wafer. The liquid is not only used to wash and clean the wafer, but also contains additives in the polishing liquid to protect the chemical stability of the wafer. In the existing grinding device, various mechanisms are generally arranged in a sealed box, including various components driven by electricity, such as a motor that drives the rotation of the ...

AI Technical Summary

Problems solved by technology

Equipment with this structure requires special waterproof treatment for various electrical components, resulting in higher costs, and it is also difficult to avoid electrical components being corroded by liquids and causing damage

On the other hand, in the existing grinding equipment, the grinding disc is usually set coaxially with the wafer, and the wafer is polished by relative rotation. This structure can only process one wafer at a time, and the efficiency is low.

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