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Vibrator and oscillator
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A vibrator, vibration attenuation technology, applied in power oscillators, impedance networks, electrical components, etc.
Active Publication Date: 2021-12-07
SEIKO EPSON CORP
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[0005]
In addition, even in the structure in which two electrode pads are arranged on the lower surface of the vibrating piece and supported at two points, if both electrode pads are arranged in the center of the width direction of the vibrating piece, there may be produces the same problem
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no. 2 Embodiment approach
[0050] Next, the vibrator of the second embodiment will be described. In addition, about the same structure as 1st Embodiment, the same code|symbol is used and the repeated description is abbreviate|omitted.
[0051] figure 2 It is a top view which shows the inside of the vibrator 1a of 2nd Embodiment, and shows the state which removed the cover 58. FIG.
[0052] In the present embodiment, unlike the first embodiment, the vibration damping members 91 and 92 are not arranged at the outer peripheral corners of the vibrating piece 10 , but are arranged along the X axis from the negative side end along the X axis. The position after the positive side shift. In addition, as in the first embodiment, the vibration damping members 91 and 92 are arranged at positions that cover the outer peripheral edges of the vibrating piece 10 on both sides in the Z′-axis direction and overlap at least a part of the lead electrodes 16 and 17 in plan view. place.
[0053] In addition, as in the ...
no. 3 Embodiment approach
[0056] Next, the vibrator of the third embodiment will be described. In addition, about the same structure as 1st Embodiment, the same code|symbol is used and the repeated description is abbreviate|omitted.
[0057] image 3 It is a top view which shows the inside of the vibrator 1b of 3rd Embodiment, and shows the state which removed the cover body 58. FIG.
[0058] In the present embodiment, as a vibration damping body, one vibration damping member 93 is arranged on the upper surface of the vibrating piece 10 . Specifically, the vibration damping member 93 is disposed between the excitation electrode 15 and the electrode pad 19 on the upper surface of the vibrating piece 10 , and is disposed so as to extend along the Z′ axis. In other words, the vibration damping member 93 is a structure in which the two vibration damping members 91 and 92 in the second embodiment are integrated. However, the vibration damping member 93 of the present embodiment does not reach the outer p...
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Abstract
The invention provides a vibrator and an oscillator, which can realize high-precision frequency characteristics with small parasitic influence. The vibrator includes a vibration element having an excitation section which is provided with excitation electrodes, and which excites a thickness shear vibration, and a fixation section electrically coupled to at least one of the excitation electrodes, a vibration attenuator disposed on at least one of principal surfaces of the vibration element, and a support substrate having a coupling electrode which is electrically coupled to the fixation section, and which supports the vibration element, wherein the vibration attenuator is disposed at the fixation section side of the excitation electrodes, and at an outer circumferential edge side of the vibration element from the fixation section in a direction perpendicular to a direction in which the excitation electrodes and the fixation section are arranged side by side.
Description
technical field [0001] The present invention relates to a vibrator and an oscillator. Background technique [0002] Patent Document 1 describes a vibrating device having a vibrating piece as an AT-cut quartz substrate in a package. In this vibrating piece, excitation electrodes and electrode pads are formed on the upper and lower surfaces, respectively, and the excitation electrodes and electrode pads are electrically connected by lead electrodes on the respective surfaces. Two electrode terminals are provided in the package, and one of the electrode terminals is electrically connected to an electrode pad formed on the lower surface of the vibrating piece, and the vibrating piece is fixed while being supported by one place. In addition, the other electrode terminal is electrically connected to the electrode pad formed on the upper surface of the vibrating piece through a bonding wire. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2015-53355 [0004] In the str...
Claims
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