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Test method and system for temperature and aging test of integrated circuits

A technology of integrated circuits and testing methods, applied in the direction of integrated circuit testing, electronic circuit testing, measuring electricity, etc., can solve the problems of low reliability of experimental results and integrated circuit control.

Active Publication Date: 2022-03-15
北京京瀚禹电子工程技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, due to the hysteresis of feedback regulation, it is difficult to accurately control the temperature of the integrated circuit at the preset temperature in actual experiments, which ultimately leads to low reliability of experimental results

Method used

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  • Test method and system for temperature and aging test of integrated circuits
  • Test method and system for temperature and aging test of integrated circuits

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Embodiment Construction

[0067] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments It is a part of the embodiments of the present disclosure, but not all of them. Based on the embodiments in the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present disclosure.

[0068] In addition, the term "and / or" in this article is only an association relationship describing associated objects, which means that there may be three relationships, for example, A and / or B, which may mean: A exists alone, A and B exist at the same time, There are three cases of B alone. In addition, the character " / " in this article ...

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Abstract

This application relates to a test method and system for integrated circuit temperature resistance aging test, which belongs to the field of integrated circuit testing, and is used to solve the problem of low reliability of the results of integrated circuit temperature resistance aging test in related technologies. And in the system, the controller receives the temperature detection data collected by the temperature acquisition module, and determines the heating power data of the integrated circuit to be tested according to the mapping curve between the working temperature and the heating power, and then combines the target temperature data to determine the control of the temperature control module. Command data, control command data enables the temperature control module to adjust the working temperature data of the integrated circuit to be tested to the target temperature data within the response time data, so as to achieve a more accurate control of the temperature of the integrated circuit to be tested in the temperature aging test. Improve the reliability of the test results of the temperature aging test.

Description

technical field [0001] The present application relates to the technical field of integrated circuit testing, in particular to a testing method and system for thermal aging testing of integrated circuits. Background technique [0002] Integrated circuit temperature aging test is an important test item in integrated circuit testing, which is used to test the life of integrated circuits. The specific principle of integrated circuit temperature resistance aging test is: make the integrated circuit work at a high temperature state higher than the standard operating temperature until the integrated circuit is damaged, so as to know the service life of the integrated circuit at a high temperature state higher than the standard operating temperature, This in turn enables the determination of the lifetime of the integrated circuit at standard operating temperatures. [0003] In related technologies, the high temperature state in the experiment of integrated circuit temperature resis...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28
CPCG01R31/287G01R31/2875
Inventor 李鹏飞李建强李涛刘龙超
Owner 北京京瀚禹电子工程技术有限公司