Solder paste printing machine for PCB substrate production
A technology for solder paste printing machines and substrates, applied in printing machines, rotary printing machines, screen printing machines, etc., can solve the problems of reducing work efficiency and achieve the effects of improving production efficiency and reducing production costs
Inactive Publication Date: 2022-01-04
苏州宁虹电子科技有限公司
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
The existing solder paste printing machine needs to manually fix the circuit boards to the positioning table one by one, and then use the stencil to print, which reduces the work efficiency. Therefore, the present invention designs a solder paste printing machine for PCB substrate production
Method used
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[0030] The concepts, specific structures, and technical effects of the present invention will be described below in connection with the drawings, and more integrated to fully understand the objects, programs and effects of the present invention. It should be noted that the features of the embodiments and embodiments in the present application can be combined with each other in the case of unlipped conditions. It should be noted that if there is no special instruction, when a feature is called "fixed", "connection" in another feature, it can be directly fixed, connected in another feature, can also be indirectly fixed, connected in another One feature. Further, the upper, lower, left, and right, etc. used in the present invention is merely the phase relationship of each component of the various components of the invention in the accompanying drawings.
[0031] like Figure 1 to 3 As shown, a PCB substrate is produced with a solder paste printing machine, including a first transport ...
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The invention relates to the technical field of solder paste printing machines, in particular to a solder paste printing machine for PCB substrate production. A second conveying part is arranged in the conveying direction of a first conveying part; a grabbing part is arranged at one side of the first conveying part and used for moving stacked PCB substrates onto the first conveying part; a fixing part is arranged above the second conveying part and used for installing a screen frame above the second conveying part; an ink pressing assembly is arranged above the fixing part and presses solder paste into the PCB substrates; and a moving part is arranged at one side of the second conveying part and drives the ink pressing assembly to move in the length direction of the PCB substrates. According to the solder paste printing machine, the PCB substrates are moved to the conveying part through the grabbing part, then the PCB substrates are conveyed to the printing position through the conveying part for printing, the traditional manual feeding step is replaced, the production efficiency is greatly improved, and the production cost is reduced.
Description
Technical field [0001] The present invention relates to the technical field of solder paste printing press, and more particularly to a PCB substrate production solder paste printing machine. Background technique [0002] Modern solder paste printers are generally composed of installment, plus paste, imprint, and power circuit boards. Its working principle is to secure the circuit board to be printed on the printing position, and then the solder paste or red glue is printed by the steel mesh or red glue by the printing machine. The existing solder paste printer needs to be manually secured to the positioning stage, and then, printing is performed using a steel net, which reduces work efficiency, and therefore, the present invention designs a PCB substrate production solder paste print press. Inventive content [0003] In this application, in order to solve the above technical problems, the present invention provides a PCB substrate production solder paste printer. [0004] The pr...
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IPC IPC(8): B41F15/08B41F15/14B41F15/20
CPCB41F15/0818B41F15/20B41F15/14B41P2217/50
Inventor 许志斌
Owner 苏州宁虹电子科技有限公司