Manufacturing method for paper buffer type board with bidirectional corrugated structure sandwich layer

A manufacturing method and sandwich layer technology, applied in the direction of mechanical processing/deformation, etc., can solve the problems of limited corrugated height, difficult processing, large amount of glue used for forming and bonding, etc., and achieve good stability and synchronization of mechanical properties The effect of lifting and small consumption of raw materials
CN113910688APending Publication Date: 2022-01-11ZHEJIANG SCI-TECH UNIV +1
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Patent Information

Authority / Receiving Office
CN Β· China
Current Assignee / Owner
ZHEJIANG SCI-TECH UNIV
Publication Date
2022-01-11

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Abstract

The invention discloses a manufacturing method for a paper buffer type board with a bidirectional corrugated sandwich layer. The manufacturing method comprises the steps that a flat-plate-shaped upper panel and a flat-plate-shape lower panel are manufactured; a cell paperboard composed of a plurality of cell plane structures is manufactured, and the multiple cell plane structures are connected and arranged on the same paperboard in a close array mode; each cell plane structure is mainly formed by connecting four identical parallelogram boards which are arranged in a shape like a Chinese character 'tian' through folding lines, and the cell paperboard is folded through folding lines of the cell paperboard to form the sandwich layer formed by a plurality of cell three-dimensional structures; and the sandwich layer is bonded with the upper panel and the lower panel correspondingly to form the paper buffer type board. The manufactured board is easy to process and form, the structural height change range is wide, and the problem that the thickness of a single corrugated board is limited is solved; and the unit mass bearing capacity and the buffering energy absorption characteristic are excellent, and the mechanical property is synchronously improved on the premise that the total thickness of the sandwich board is increased.
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Description

technical field

[0001] The invention belongs to the technical field of new materials and relates to a method for making a paper board, in particular to a method for making a paper buffer board with a bidirectional corrugated sandwich layer. Background technique

[0002] Due to the demand for environmental protection, the consumption and market demand of paper cushioning boards have been very strong. At present, most of the paper cushioning plates on the market are three-layer corrugated cardboard, multi-layer corrugated cardboard or honeycomb cardboard. Three-layer corrugated cardboard (also known as single corrugated cardboard) has relatively high compressive strength, but the cushioning performance is not good, and the corrugated height is limited. It can only reach 6.6-7.0mm; although multi-layer corrugated cardboard can increase the overall thickness of the structure by superimposing multiple corrugated core layers or bonding multiple single-layer corrugated cardboards,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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