Manufacturing method for paper buffer type board with bidirectional corrugated structure sandwich layer

A manufacturing method and sandwich layer technology, applied in the direction of mechanical processing/deformation, etc., can solve the problems of limited corrugated height, difficult processing, large amount of glue used for forming and bonding, etc., and achieve good stability and synchronization of mechanical properties The effect of lifting and small consumption of raw materials

Pending Publication Date: 2022-01-11
ZHEJIANG SCI-TECH UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Three-layer corrugated cardboard (also known as single corrugated cardboard) has relatively high compressive strength, but the cushioning performance is not good, and the corrugated height is limited. It can only reach 6.6-7.0mm; although multi-layer corrugated cardboard can increase the overall thickness of the structure by superimposing multiple corrugated core layers or bonding multiple single-layer corrugated cardboards, the processing process is complicated and the bonding strength between layers is also low. It will have a great impact on the mechanical properties of the entire material, and because the corrugated peaks and valleys of the adjacent corrugated core layer or adjacent single corrugated cardboard are not perfectly aligned, the cushioning performance of the final multi-layer corrugated cardboard is acceptable but The problem of poor compressive strength is even more unfavorable. In the pr

Method used

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  • Manufacturing method for paper buffer type board with bidirectional corrugated structure sandwich layer
  • Manufacturing method for paper buffer type board with bidirectional corrugated structure sandwich layer
  • Manufacturing method for paper buffer type board with bidirectional corrugated structure sandwich layer

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0073] Preferred Example 1:

[0074] Select a quantification of 170g / m 2 The kraft paper is used as the upper plate and the lower plate, which is set to 170 g / m. 2 Corrugated paper as a sandwich layer; the sandwich layer is made of a first type of primary stem structure having the following basic structural characteristics: the cell stereo structure consists of the same parallelogram plate material as 4 geometric parameters, parallel four sides of the parallelogram Ten mM, the angle δ of the two sides is 60 °, the folding angle γ is 80 °, and it is recorded as a sample 1 #. The thickness of the sample 1 # was 7.99 mm.

Example Embodiment

[0075] Preferred Example 2:

[0076] Select a quantification of 170g / m 2 The kraft paper is used as the upper plate and the lower plate, which is set to 170 g / m. 2 Corrugated paper as a sandwich layer; the sandwich layer is made of a second type of germoscopic structural topology having the following basic structural characteristics: the cell stereo structure consists of the same parallelogram sheet having the same parallelogram of 4 pieces of geometric parameters, and two sides of parallelogram respectively. For A = 10 mm, b = 20 mm, the angle δ of the two sides is 60 °, the folding angle γ is 80 °, which is recorded as a sample 2 #. The thickness of the sample 2 # was 7.99 mm.

Example Embodiment

[0077] Preferred Example 3:

[0078] Select a quantification of 170g / m 2 The kraft paper is used as the upper plate and the lower plate, which is set to 170 g / m. 2 Corrugated paper as a sandwich layer; the sandwich layer is formed by a third-class stereoscopic structure having the following basic structural characteristics: the cell stereo structure consists of the same parallelogram sheet having the same four-piece geometric parameters, parallel quadrilateral two sides For A = 20 mm, b = 10 mm, the angle δ of the two edges is 60 °, the folding angle γ is 80 °, and it is recorded as a sample 3 #. The thickness of the sample 3 # was 16.00 mm.

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Abstract

The invention discloses a manufacturing method for a paper buffer type board with a bidirectional corrugated sandwich layer. The manufacturing method comprises the steps that a flat-plate-shaped upper panel and a flat-plate-shape lower panel are manufactured; a cell paperboard composed of a plurality of cell plane structures is manufactured, and the multiple cell plane structures are connected and arranged on the same paperboard in a close array mode; each cell plane structure is mainly formed by connecting four identical parallelogram boards which are arranged in a shape like a Chinese character 'tian' through folding lines, and the cell paperboard is folded through folding lines of the cell paperboard to form the sandwich layer formed by a plurality of cell three-dimensional structures; and the sandwich layer is bonded with the upper panel and the lower panel correspondingly to form the paper buffer type board. The manufactured board is easy to process and form, the structural height change range is wide, and the problem that the thickness of a single corrugated board is limited is solved; and the unit mass bearing capacity and the buffering energy absorption characteristic are excellent, and the mechanical property is synchronously improved on the premise that the total thickness of the sandwich board is increased.

Description

technical field [0001] The invention belongs to the technical field of new materials and relates to a method for making a paper board, in particular to a method for making a paper buffer board with a bidirectional corrugated sandwich layer. Background technique [0002] Due to the demand for environmental protection, the consumption and market demand of paper cushioning boards have been very strong. At present, most of the paper cushioning plates on the market are three-layer corrugated cardboard, multi-layer corrugated cardboard or honeycomb cardboard. Three-layer corrugated cardboard (also known as single corrugated cardboard) has relatively high compressive strength, but the cushioning performance is not good, and the corrugated height is limited. It can only reach 6.6-7.0mm; although multi-layer corrugated cardboard can increase the overall thickness of the structure by superimposing multiple corrugated core layers or bonding multiple single-layer corrugated cardboards,...

Claims

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Application Information

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IPC IPC(8): B31F1/20
CPCB31F1/20
Inventor 朱先梅鄂玉萍杨光
Owner ZHEJIANG SCI-TECH UNIV
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