Image projection device and vehicle lamp

[0062] (First embodiment)

[0063] Hereinafter, the embodiment of the present invention will be described in detail with reference to the accompanying drawings. The same or equivalent constituent elements, components shown in each of the figures, and the same reference numerals are simed to omitted. figure 1 It is a schematic perspective view showing the configuration example of the vehicle lamp 100 of the present embodiment. figure 1 The illustrated vehicle lamp 100 includes an image projection device 10, a light source unit 20, a reflector 30, a projection lens 40, a heat sink 50, and projection of a projection surface 60.

[0064]The image projection device 10 is an apparatus which is irradiated from the light source portion 20 as a projected light LON and a shielding light Loff as a projected light LON and a shielding light Loff. The projection light LON is irradiated with the projection surface 60 via the projection lens 40, and the image is projected by irradiating the light to the area corresponding to the open information. The shielding light Loff is blocked without the illustrated shadow, not irradiated to the outside.

[0065] The light source unit 20 is means of irradiating light based on the electric power and signal supplied from the outside, for example, can be used, for example, a light emitting diode (Light Emitting Diode) or a semiconductor laser (Laser: LightamphemationBy Stimulated EMISSIONOF RADITION). The light illuminated from the light source portion 20 may be a continuous light (CW: Continuous Wave), or also light controlled by PWM (Pulse Width Moduction, pulse width modulation).

[0066] The reflector 30 is an optical member that reflects the light of the light source portion 20 to the image projection device 10. The reflective surface shape of the reflector 30 is not limited, and a surface of a parabolic or an elliptic surface or the like can be used. The light reflected by the reflector 30 can be enlarged toward the image projection device 10, or may be parallel light.

[0067] The projection lens 40 is an optical member disposed on the optical path of the projection light LON reflected in the image projection device 10, enlarged the projection light LON to be irradiated with respect to the projection surface 60. figure 1 The use of a lens as an example of a projection lens 40, or a multi-faceted lens may be provided. and figure 1 Examples of convex lens are shown, and a lens structure known to a concave lens or an aspherical lens or the like can be used.

[0068] The heat sink 50 is a component configured to improve heat dissipation in the light source unit 20. The material constituting the heat radiator 50 is not limited, for example, copper or aluminum, high thermal conductive resin, or the like, which can be used in thermal conductivity. And the configuration and shape of the heat sink 50 is not limited, and a plurality of heat sinks can be further provided in the rear side to further improve heat dissipation.

[0069] The projection surface 60 is a surface disposed outside the vehicle lamp 100, and is irradiated with a surface of the image light LON. As the projection surface 60, for example, the road surface of the road, the wall surface of the structure, the vehicle body of the other vehicles, the vehicle body of the vehicle, and the like. figure 1 The plane is expressed as the projection surface 60, but may be a surface or a surface of a surface or a surface may be projected by being projected by being illuminated by the projected light LON.

[0070] figure 2 It is a schematic plan view showing the configuration example of the image projection device 10 of the present embodiment. image 3 The image projection device 10 shown includes a mirror mounting substrate 101a, a power mount substrate 101b, a digital microscope device 102, a temperature sensor portion 103, a mirror control unit 104, a flash memory 105, a mirror control unit, a power supply unit 106 The voltage monitoring unit 107, the flexible cable 108, the mirror power supply unit 109, the control microcomputer 110, the voltage adjustment unit 111, the microcomputer power supply unit 112, the subsequator 113, the cooling power supply unit 114, the connector portions 115, 116.

[0071] The mirror mounting substrate 101a and the power supply mounting substrate 101b are as follows: a circuit board for mounting an electronic component formed by a splitter, forming a wiring pattern (not shown), and electrical components mounted on the surface Connect and constitute a circuit. figure 2 Examples of mounting electronic components only on the surface side may also form a wiring pattern on the back side to carry an electronic component. The material constituting the mirror mounting substrate 101a and the power mounting substrate 101b is not limited, and the printed circuit board such as the public can be used. In order to improve the heat dissipation property of the mirror mounting substrate 101a and the power supply mounting substrate 101b, a composite substrate that forms an insulating layer and a wiring pattern can be used on a substrate formed of a high thermal conductive material such as a metal or ceramic or the like. Further, the mirror mounting substrate 101a and the power mounting substrate 101b may be formed as the same material and the same configuration, or may be formed of different materials and different configurations.

[0072] like figure 2 As shown, the mirror is mounted on the substrate 101a on the substrate 101a, a temperature sensor unit 103, a temperature sensor portion 104, a flash memory 105, a flash memory 105, a mirror control unit 107, and a voltage monitoring unit 107. Further, the power supply substrate 101b is mounted on the substrate 101b, and the microcomputer 110, the voltage adjustment unit 111, the microcomputer power supply unit 112, the cooling power supply unit 114, and the connector portions 115, 116 are controlled.

[0073] The digital microscope device 102 is a microscope configured as a matrix, and an electronic component capable of changing the inclination angle in an open state and a positional state. The projection light LOFF in the open state reflected in the mirror is separated from the shielding light Loff in which the state reflected, and the image is projected by the projected light LON.

[0074] The temperature sensor unit 103 is an electronic component disposed in the vicinity of the digital microscope device 102, measuring the temperature of the digital microscope device. The temperature measured by the temperature sensor unit 103 is transmitted to the mirror control unit 104 and the control microcomputer 110 as the temperature information. The specific configuration of the temperature sensor unit 103 is not limited, and a thermistor or thermocouple, a digital temperature sensor, and the like can be used.

[0075] The mirror control unit 104 is a relative digital micromirror device 102, transmitting a control signal based on the open information and the information included in the image, and switch the electronic components of the controlled mirror and the open state of the mirror. And the mirror control unit 104 is connected to the control microcomputer 110 via the flexible cable 108, and controls the drive by controlling the control signal of the microcomputer 110. The mirror control unit 104 and the digital microscope device 102 are required to operate at an extent necessary (e.g., 600 MHz or more) necessary to write, and thus close to the configuration on the mirror mounting substrate 101a.

[0076] The flash memory 105 is a memory portion for maintaining the necessary information in the drive of the mirror control unit 104. As the information stored in the fast flash memory 105, the programs, various setting information, image data, and the like executed in the mirror control unit 104 can be used.

[0077] The mirror control unit power supply unit 106 is a power supply circuit supplied from the voltage adjustment unit 111 via the flexible cable 108 to provide power to the mirror control unit 104. In the mirror control unit power supply unit 106, a relatively large voltage is supplied from the voltage adjustment unit 111 via the flexible cable 108, and therefore, multiple DC / DC converters, suction depressurization to the mirror control unit power supply unit 106. Power is output for the driving of the drive of the mirror control unit 104. As the voltage conversion example of the mirror control unit, for example, DC6V, DC3.3V, 1.8V, 1.1V, and the like are supplied.

[0078] The voltage monitoring unit 107 is an electronic component that monitors the mirror driving voltage supplied from the reflective mirror power supply unit 109 from the mirror device via the flexible cable 108. The voltage monitoring unit 107 is electrically connected to the mirror control unit 104 and the control microcomputer 110 to transmit the measured voltage of the monitor. As an example, in the case where the voltage on the mirror supplied by the flexible cable 108 is lower than the predetermined value, the mirror control unit 104 stops the action of the digital microscope device 102. Thereby, it is possible to detect the broken line or contact of the flexible cable 108, the failure of the mirror power supply unit 109, and the like can be detected, and the erroneous operation of the digital microscope device 102 is prevented.

[0079] The flexible cable 108 is a wiring cable for protecting a plurality of wirings together by a resin or the like having a flexible resin such that the mirror is electrically connected between the substrate 101a and the power mounting substrate 101b. The connection method between the flexible cable 108 and the mirror mount substrate 101a, the power mounting substrate 101b is not particularly limited, and the form of the connector mounted on the two substrates can be used. Since the flexible cable 108 has flexibility, the mutual electrical connection can be ensured by bending without the configuration of the two substrates.

[0080] The reflective mirror power supply unit 109 is supplied from the outside of the image projection apparatus 10 from the outside of the image projection apparatus 10 to provide power supply circuit to the digital microscope 102 via the connector portion 115. The reflective mirror power supply unit 109 is composed of a plurality of electronic components, including a series regulator and a DC / DC converter. As the output example of the mirror power supply unit 109, for example, DC16V, 8.5V, -10V, and the like can be used.

[0081] The control microcomputer 110 is based on the control signal and various measured values, and controls the driven electronic components of the entire image projection device 10. The control microcomputer 110 can communicate with the external information via the connector portion 116, which is supplied from the outside to the outside information and the control signal. Further, the measurement value of the mirror control unit 104, the temperature sensor unit 103, and the voltage monitoring unit 107 is transmitted to the control microcomputer 110.

[0082] When the control microcomputer 110 transmits image information from the outside, the control microcomputer transmits image information to the mirror control unit 104 via the flexible cable 108, and performs control of the open state of the mirror and the control of the position. And the control microcomputer 110 controls the driving of the cooling portion illustrated based on the temperature information of the temperature sensor unit 103, and controls the temperature of the digital microscope device 102. Here, the items known to the cooling fan or liquid cooling device, the Peltier element can be used. And control the microcomputer 110, controlling the driving of the image projection device 10 based on the measured value of the voltage monitoring unit 107, for example, in the case where the signal loss of the voltage monitoring unit 107, can determine the disconnection or falling of the flexible cable 108 and stop the mirror. The output of the power supply unit 109 is used.

[0083] Here, the control microcomputer 110 controls the cooling power supply unit 114 and the cooling portion by performing a pre-recorded program, and the cooling control portion in the present invention is also constituted for the cooling image projection device 10. Here, a portion of the control microcomputer 110 function is used as a cooling control unit, and the dedicated electronic component can be mounted on the power source mounting substrate 101b to function as a cooling control unit.

[0084] The voltage adjustment unit 111 is composed of a series regulator and a DC / DC converter, and the circuit of adjusting the voltage is used in combination with the reflective mirror power supply unit 109. As the voltage conversion example of the voltage adjustment unit 111, for example, DC12V is supplied, and DC6V and 3.3V, etc. are supplied.

[0085] The microcomputer power supply unit 112 is a power supply circuit that supplies power from the outside of the image projection device 10 via the connector portion 115 to provide power to the control microcomputer 110. The microcomputer power supply unit 112 is composed of a series regulator as an output example, and is, for example, DC3.3V, 5V, and the like.

[0086] The decormer 113 is transmitted to the electronic components of the mirror control unit 104 via a serial data via a serial data via a connector portion 116 that transforms serial data to parallel data.

[0087] The cooling power supply unit 114 is a power supply circuit that supplies power from the outside of the image projection device 10 via the connector portion 115 to provide power to the cooling portion of the illustrated. The cooling power supply unit 114 is constructed of a series regulator as an output example, and is, for example, DC5V or the like.

[0088]The connector portions 115, 116 are electrically connected to the outer electrical connection of the image projection device 10 by insertion of the cable or the like. In the image projection device 10, power supply unit 109 is supplied from the outside via the connector portion 115, the microcomputer power supply unit 112, and the cooling power supply unit 114 supplies power. Further, the control signals and information are transmitted between the mirror control unit 104 and the external portion via the connector portion 116.

[0089] like figure 2 As shown, in the image projection device 10 of the present embodiment, the mirror mounting substrate 101a and the power mounting substrate 101b are electrically connected by a flexible cable 108, and power or control signals can be transmitted between the two. However, since the flexible cable 108 has a resin that covers the flexible resin around the electrical wiring, the heat conduction between the mirror mounting substrate 101a and the power mounting substrate 101b is suppressed. Thereby, it is possible to prevent heat transfer of the electronic component generated by the power source mounting substrate 101b to the mirror mounting substrate 101a side, and suppressing the temperature rise of the digital microscope device 102.

[0090] Further, since the mirror mounting substrate 101a and the power mounting substrate 101b are formed by splitting, the electronic component having a relatively small heat transfer is mounted on the mirror mounting substrate 101a, and the electronic component having a relatively large heat transfer is mounted on the power supply substrate. 101B, it is possible to miniaturize and light quantification without the increase in the temperature rise of the digital microscope device 102 without causing the circuit board.

[0091] Here, as an electronic component having a relatively small amount of heat generation, the mirror control unit is enumerated. As described above, the mirror control unit power supply unit 106 is composed of a DC / DC converter, which is small due to high conversion efficiency. Further, the DC / DC converter has a large current capacity, which is excellent in power (current) fluctuation response performance, but the opposite side is a large number of electronic components constituting the circuit and the mounting area is large. However, in the image projection device 10 of the present embodiment, the region of the mirror control unit is configured to configure the mirror control unit 106 by mounting the electronic component by the power mounting substrate 101b, and is easily secured to the region of the mirror control unit.

[0092] As an electronic component having a relatively large heat generation, the mirror power supply unit 109, the voltage adjustment unit 111, the microcomputer power supply unit 112, and the cooling power supply unit 114 can be used. As described above, the reflective mirror power supply unit 109, the voltage adjustment unit 111, the microcomputer power supply unit 112, and the cooling power supply unit 114 include a series regulator, which is high due to low conversion efficiency. The series regulator has a small current capacity and the response performance of the load (current) changes is lower than the DC / DC converter, however the mounting area can be small due to a chip configuration. In the image projection device 10 of the present embodiment, the temperature rise of the digital microscope device 102 can be suppressed by mounting a series adjuster on the power source mounting substrate 101b different from the mirror mounting substrate 101a. Further, by mounting the series adjuster capable of consisting of a chip on the power mounting substrate 101b, the mounting density of the electronic component on the substrate 101b can be reduced, and the temperature rise of the power mounting substrate 101b can be suppressed.

[0093] As the other electronic components, the mirror control unit 104 operates as the digital microscope device 102, and requires a shortening of the wiring thus mounted on the mirror mounting substrate 101A. And the temperature sensor unit 103 is mounted on the mirror mounting substrate 101a due to the measurement of the temperature of the digital microscope device 102. And the flash memory 105 is transmitted due to the information transfer of image information or procedures such as the mirror control unit 104, so that the mirror control unit 104 is mounted on the mirror mount substrate 101a. And the voltage monitoring unit 107 is a portion for detecting an abnormality of the voltage supplied to the substrate 101a side of the substrate 101a on the mirror, and is thus mounted on the mirror mounting substrate 101a.

[0094] For the control microcomputer 110, it is not necessary to operate like the digital microscope device 102, since information is required to communicate with the outside, and even if the flexible cable 108 has an error, it is necessary to continue to operate, so it is equipped with power supply The substrate 101b. The demultiplexer 113 is passed to the mirror control unit 104 in order to transform the serial data passed to parallel data via the connector portion 116, and is mounted on the power supply mounting substrate 101b.

[0095] image 3 It is a block diagram schematically showing the power supply line of the image projection device 10 of the present embodiment. The power supply unit 109 supplied from the outside via the connector portion 115, the power supply unit 112 and the cooling power supply unit 114 are transmitted from the external power supply unit 109. As the electric power supplied from the outside, it is possible to enumerate DC12V supplied from the battery carried by the vehicle. exist image 3 In the example, the microcomputer power supply unit 112 includes two series adjusters, which output 3.3 V of the control microcomputer 110 and 5V for driving the interface portion. The interface power source is a power supply for input and output signals when the external device (LDM: LED DriverModule) that controls the LED drive. The cooling power supply unit 114 includes a series regulator that outputs 5V for driving the cooling portion, i.e., a cooling fan or the like.

[0096] The mirror power supply unit 109 and the voltage adjustment unit 111 are provided with a plurality of DC / DC converters and a plurality of series regulators, and the output voltage is adjusted via the flexible cable 108. The voltage adjustment unit 111 boosts 12V supplied from the outside to 20V in the DC / DC converter from the outside to 20V, and bucks down to 6V output in the DC / DC converter in the second phase. A portion of the output of the DC / DC converter in the second stage is supplied to the mirror control unit power supply unit 106 via the flexible cable 108, and partially supplied to the series regulator and the mirror power supply unit 109 of the voltage adjustment unit 111. In the series regulator included in the voltage adjustment unit 111, 6V is converted to 3.3V to the reflective mirror power supply unit 109. In the mirror power supply unit 109, 16V, 8.5V, -10V is generated from the supplied 6V and 3.3V, and is supplied to the digital microscope device 102 via the flexible cable 108.

[0097] The reflective mirror power supply unit 109 includes three DC / DC converters, which are supplied to 1.1V, 1.8V, 3.3.3V, respectively, to the mirror control unit 104, respectively, to the mirror control unit 104 via the flexible cable 108. Further, the output of 1.8V is also supplied to the digital microscope device 102.

[0098] Figure 4 It is a schematic diagram showing a configuration example of the flexible cable 108 of the present embodiment. The flexible cable 108 includes a power supply wiring 108a, a single-end wiring 108b, a difference distribution line 108c, a single end wiring 108d, a ground wiring 108e. Each wiring extends in the longitudinal direction of the flexible cable 108, and is formed at equal intervals in the lateral direction. exist Figure 4 In the example, the single-end wiring 108b, 108d, and the difference assignment line 108c are formed by thin line width (first line width). Further, the power supply wiring 108a and the ground wiring 108e are formed from a wire width (second line width) of the thickness to the first wiring.

[0099] The power supply wiring 108a is a wiring formed on one side of the lateral direction of the flexible cable 108, which is electrically connected to the second stage of the voltage adjustment unit 111 and the mirror control unit power supply unit 106. Wiring. Since the DC / DC converter needs to supply the DC / DC converter from the voltage adjustment unit 111 to the mirror control unit power supply unit 106, the line width of the power supply wiring 108A is coarsely connected to single-end wiring 108b, 108d and differentials. Wiring 108c. Specifically, in the case where the single-end wiring 108b, 108d and the difference distribution line 108c are formed by the first line width, the power supply wiring 108a is formed by a second line wide, which is twice the first line width. Thereby,, for example, even if the allowable current of the single-end wiring 108b, 108d, and the difference distribution line 108c is 500 mA, the allowable current of the power supply wiring 108a can be made above 1A.

[0100] The single-ended wiring 108b, 108d is formed from the line width (first line width) finer in the power wiring 108a, and is a wiring between the mirror mounting substrate 101a and the power mounting substrate 101b. And the two end portions of the single-end wiring 108b, 108d to the flexible cable 108 are formed by the first line.

[0101] The difference distribution line 108c is formed by the center of the wire width (first line width) of the flexible cable 108, and transmitting an electrical signal between the mirror mounting substrate 101a and the power mounting substrate 101b. String. And the difference distribution line 108c is designed in a different manner different from the characteristic impedance of the single-ended wiring 108b, 108d. As an example, the characteristic impedance of the single-end wiring 108b, 108d is 50 Ω, and the characteristic impedance of the difference distribution line 108c is 100 Ω.

[0102] The ground wiring 108e is a wiring formed in the lateral direction of the flexible cable 108 on the other side, and is a wiring that connects the mirror to the ground potential of the substrate 101a and the power source mount substrate 101b. Between the mirror mounting substrate 101a and the power mounting substrate 101b, since the relatively large current is supplied from the DC / DC converter 111 to the mirror control unit power supply unit 106, the line width of the ground wiring 108e is acquired by the power supply. The same line width of the line 108a is formed. Thereby,, for example, even if the allowable current of the single-end wiring 108b, 108d and the difference distribution line 108c is 500 mA, the allowable current of the ground wiring 108e can be 1a or more.

[0103] Figure 5 It is a schematic diagram showing a case where the electrostatic protection element 120 is disposed on each of the wiring patterns (omitted) on the mirror mounting substrate 101a and the power mounting substrate 101b. like Figure 5 As shown, if the electrostatic protective element 120 is disposed in each wiring pattern, the number of protective elements mounted on the mirror on the substrate 101a and the power source mounting substrate 101b is increased, and the miniaturization is difficult.

[0104] Image 6 It is a partial enlarged view showing the surge measures of the electrostatic protection element 122 of the image projection device 10 of the present embodiment. exist Image 6 The illustration of the difference distribution line 108c is omitted in the example shown. And Image 6 In, only the expansion of the mirror is adjacent to the flexible cable 108 connection region. Further, although only the mirror mount substrate 101a is expanded, the power supply mounting substrate 101b also has the same configuration.

[0105] like Image 6 As shown, in the image projection device 10 of the present embodiment, the connector portion 117 is mounted on the peripheral portion on the mirror mounting substrate 101a, and the connector portion 117 is electrically connected to a power supply wiring pattern formed on the mirror mounting substrate 101a. 121A, signal wiring pattern 121b, 121d, ground wiring pattern 121e. The electrostatic protection element 122 is respectively mounted on the signal wiring pattern 121b and 121d, respectively.

[0106] like Image 6 As shown, by inserting the flexible cable 108 into the connector portion 117, the power supply wiring 108a, the single-end wiring 108b, 108d, and the ground wiring 108e are respectively connected to the power supply wiring pattern 121a, signal wiring, respectively, respectively, respectively. The patterns 121b, 121d, the ground wiring pattern 121e electrically connected.

[0107]The power supply wiring pattern 121a is connected to the power supply wiring 108a of the flexible cable 108, a mirror control unit mounted from the mirror power supply unit 109 and the voltage adjustment unit 111 to the mirror to mount the substrate 101a, and digital micromirror The device 102 provides a power distribution pattern. The signal wiring pattern 121b, 121d is a wiring pattern that transmits an electric signal between the mirror mounting substrate 101a and the power mounting substrate 101b between the mirror mounting substrate 101a and the power mounting substrate 101b. The ground wiring pattern 121E is a wiring pattern that is provided with the ground wiring 108e of the flexible cable 108, which provides a ground potential to the electronic component mounted on the mirror mounted substrate 101a.

[0108] The electrostatic protective element 122 is an electronic component connected to the plurality of wiring patterns connected to the signal wiring patterns 121b, 121d. When the signal wiring pattern 121b, 121d flows through the surge current, the waves flows to the ground. The potential is escorted, and the electronic component mounted on the mirror is mounted on the substrate 101a. exist Image 6 In the middle, four wiring patterns included as the signal wiring patterns 121b, 121d are shown, and the four wiring patterns are protected together in a static protection element 122, but the wiring pattern connected to a static protection element 122. The number of roots is not limited.

[0109] Figure 7 A diagram showing the configuration example of the electrostatic protection element 122 of the present embodiment, Figure 7 (a) means a schematic top view of the packaging appearance and terminal, Figure 7 (b) is an equivalent circuit diagram. like Figure 7 (a), D1 + terminal, D1-terminal, GND terminal, D2 + terminal, and D2-terminals are set in parallel to the electrostatic protection element 122. Also, the GND terminal is disposed between the D1-terminal and the D2 + terminal. The shape and size of the electrostatic protective element 122 is not limited, and can be used, for example, a size of 3 to 4 mm, a degree of vertical 2 to 3 mm, a vertical 2 to 3 mm, a degree of vertical 2 to 3 mm, a degree of vertical 2 to 3 mm, a D2 + terminal, a D2-terminal, a D2 + terminal, a D2-terminal, a D2 + terminal, a D2-terminal .

[0110] Electrostatic protection element 122 Figure 7 (b) Multi-diode and regulator diode as shown in (b), two two diodes connected in series are connected in parallel, and one regulator diode is also connected in parallel. The cathode side of the connected diode is connected to the cathode side of the regulator diode, the anode side is connected to the GND terminal to form a ground potential. Further, the intermediates of the two diodes connected in series are respectively connected to the D1 + terminal, D1-terminal, D2 + terminal, D2-terminal. Here, the D1 + terminal, the D1-terminal, the D2 + terminal, and the D2-terminal are terminals connected to the signal wiring patterns 121b, 121d, corresponding to the signal wiring terminal in the present invention.

[0111] The anode side of the regulator diode is coupled to the GND terminal to form a ground potential, and the cathode side is connected to the cathode side of the diode connected in series. Here, the GND terminal is thus corresponding to the ground terminal in the present invention due to the connection of the ground potential. Further, it is preferable that the ground wiring pattern 121e connected to the ground wiring 108e is formed in respectively.

[0112] On the mirror mounting substrate 101a and the power supply substrate 101b, the D1 + terminal, the D1-terminal, the D2 + terminal, the D2-terminal are respectively connected to the signal wiring pattern 121b, 121d, respectively, the GND terminal is connected to the reflection described later. The mirror is mounted on the GND1 terminal and the GND2 terminal on the substrate 101a. Thereby, when the image projection device 10 is used, the signal is transmitted to the electronic component via the flexible cable 108, the connector portion 117 and the signal wiring pattern 121b, 121d. In the case of applying a surge voltage of the displacement voltage of the regulator diode on the side of the connector portion 117, the surge current is made via D1 + terminal, D1-terminal, D2 + terminal, D2-terminal, diode, regulator diode and GND terminal. From the signal wiring patterns 121b, 121d flows to the ground potential.

[0113] Thereby, the mirror mounting the substrate 101a and the power supply mounting substrate 101b are formed and the temperature of the digital microscope 102 is connected by the flexible cable 108, while the temperature of the digital microscope device 102 can be increased, the static electricity when the flexible cable 108 is connected. Protect electronic components and can miniaturize circuit boards. Since the electrostatic protection element 122 is connected with respect to a plurality of wiring patterns, it is possible to improve the density of the signal wiring patterns 121b and 121d to further reduce the mirror mounting substrate 101a and the power mounting substrate 101b.

[0114] Further, the electrostatic protection element 122 includes a plurality of diodes corresponding to the number of signal wirings 121b, 121d, making the diode in parallel to each wiring pattern. Thereby, deterioration of the signal waveform is more capable of suppressing the deterioration of the signal waveform than the electrostatic response measures of the capacitor, even in the electronic device of the high-speed operation like the image projection device 10.

[0115] Further, the electrostatic protection element 122 includes a regulated diode connected in parallel to the signal wiring patterns 121b, 121d, and the regulator diode is connected in parallel to a plurality of diodes. Thereby, it is possible to use a voltage regulator diode to electrostatically respond to the plurality of wiring patterns in the signal wiring patterns 121b, 121d, and the electrostatic protection element 122 can be miniaturized to reduce the mounting area, and further make the mirror to carry the substrate 101a. And the power is mounted on the substrate 101b miniaturization.

[0116] Further, by configuring the GND terminal between the D1 + terminal, the D1-terminal, the D2 + terminal, the D2-terminal) included in the electrostatic protection element 122, and the terminal is arranged, and the error is prevented from being mounted on the signal wiring pattern 121b and 121d. .

[0117] As described above, in the image projection device 10 of the present embodiment, since the electrostatic protection element 122 is connected with respect to the plurality of signal wirings, 121D, the density of the signal wiring pattern 121b and 121d can be improved. The mirror mounting the substrate 101a and the power source mounting substrate 101b, and can also be protected on the mirror on the mounting substrate 101a and the electrical mounting substrate 101b when it is connected to the flexible cable 108.

[0118] (Second Embodiment)

[0119] Next, use Figure 8 A second embodiment of the present invention will be described. An explanation of the contents of the first embodiment will be omitted. Figure 8 It is a diagram showing the image projection device 10 of the present embodiment, Figure 8 (a) is a partially enlarged photograph showing a state in which a substrate 101a and a power source mounting substrate 101b are connected to the mirror 101b. Figure 8 (b) is Figure 8 Partially enlarged view of the electrostatic protection element 122 in (a).

[0120] exist Figure 8 In the example shown, the flexible cable 108 includes 39 single-end wirings 108b, 108d, the mirror mounting substrate 101a and the power mounting substrate 101b, respectively, 30 signal wiring patterns 121b, 121d, respectively. As the electrostatic protection element 122 Figure 7 The elements shown are mounted on the mirror mounting substrate 101A and the power supply substrate 101b, respectively, on the mirror mount substrate 101a, respectively, on the mirror mounting substrate 101a, respectively.

[0121] In this embodiment Figure 8 (b) As shown, the mirror is mounted on the substrate 101a forming signal wiring patterns 121b1, 121b2, 121b3, 121b4, and ground wiring patterns GND1, GND2. The ground wiring pattern GND1, GND2 is formed between the signal wiring patterns 121B2 and 121B3, and the line width is larger than the signal wiring pattern 121b, and is formed substantially circular at the end. The D1 + terminal, the D1-terminal, the GND terminal, the D2 + terminal, and the D2-terminal of the electrostatic protection element 122 are respectively connected to the signal wiring patterns 121b1, 121b2, the ground wiring pattern GND1, GND2, and signal wiring patterns 121b3, 121b4.

[0122] Since the D1 + terminal, the D1-terminal, the GND terminal, the D2 + terminal, and the D2-terminal of the electrostatic protection element 122 are disposed in the same interval, the signal wiring patterns 121b1, 121b2, 121b3, 121b4 are laterally connected to the end of the ground wiring pattern GND1, GND2. The circular manner in the portion forms a curved pattern.

[0123] In the mirror mount substrate 101a and the power mounting substrate 101b, the circular portion at the end of the ground wiring pattern GND1 and GND2 forms a through hole, formed on the ground wiring pattern GND1, GND2 on the back side and the surface side. . In this way, by extending the ground wiring pattern GND1, GND2 using through holes, the ground potential can be provided to a plurality of electrostatic protection elements 122.

[0124] exist Figure 9 In the case where a signal wiring pattern 2 is mounted, a width of the ground wiring pattern 1 to 2 mm is 2 mm from the ground wiring pattern 1 to the electrostatic protection element 3, 39 block wiring patterns 1 and the electrostatic protection Component 3 requires a width of 78 mm.

[0125] However, in the image projection device 10 of the present embodiment, such as Figure 8 (a) (b), the ground wiring pattern GND1, GND2 is provided with a through hole to provide the ground wiring patterns GND1, GND2, and the port line pattern GND1, GND 2 is provided with respect to the four signal wiring patterns 121b1, 121b2, 121b3, 121b4, and the electrostatic protection element 122 performs electrostatic response measures. At this time, in order to protect the width required for the four signal wiring pattern 121b, it is sufficient to be 3 to 4 mm as the width of the electrostatic protection element 122. Therefore, the width required for 10 electrostatic protective elements 122 is 30 to 40 mm, and thus the density of the signal wiring pattern 121b, 121d can be improved, and the mirror mounting substrate 101a and the power source mounting substrate 101b can be realized.

[0126] And Figure 8 In the example shown, by setting the ground wiring pattern GND1, GND2 to the upper and lower parts, even in the case of the upper and lower cases of the mistake of the electrostatic protection element 122, the ground potential can be reliably supplied to the GND terminal. It is possible to protect the signal wiring pattern 121b.

[0127] Even in the image projection device 10 of the present embodiment, since the electrostatic protection element 122 is connected with respect to the plurality of signal wirings, 121D, the density of the signal wiring pattern 121b and 121d can be improved to improve the mirror mount substrate. 101A and the power supply mounting of the substrate 101b, and can also be protected on the mirror on the mounting substrate 101a and the electrical mounting substrate 101b when it is connected to the flexible cable 108. Further, by extending the ground wiring pattern GND1, GND2 by the through hole to extend from the back surface side to the surface side, the mounting surface of the electrostatic protection element 122 can be reduced, and the mirror mounting substrate 101a and the power mounting substrate 101b are further achieved.