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Method for mass transfer of chips and equipment for mass transfer of chips

A technology for chip transfer and transfer equipment, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of limited transfer speed and guide rail wear, and achieve the effect of avoiding low efficiency and guide rail wear problems.

Active Publication Date: 2022-02-25
FOSHAN HUADAO SUPER PRECISION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above solutions all require frequent short-distance reciprocating positioning, which brings two problems: 1. Partial wear of the guide rail; 2. Even the start and stop of tens of microns takes ten milliseconds, resulting in a transfer speed of only tens of per hour chips

Method used

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  • Method for mass transfer of chips and equipment for mass transfer of chips
  • Method for mass transfer of chips and equipment for mass transfer of chips
  • Method for mass transfer of chips and equipment for mass transfer of chips

Examples

Experimental program
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Effect test

Embodiment 1

[0058] The main components of the chip mass transfer equipment proposed in this application include: platform base 1, gantry X-axis platform 2, gantry Y-axis platform 3, gantry Z-axis platform 4, two-dimensional flexible platform 5, crystal film micro-movement platform 6 , Crystal film macro motion platform 7, substrate feeding platform 8.

[0059] Among them, the platform base 1, the gantry X-axis platform 2, the gantry Y-axis platform 3, the gantry Z-axis platform 4 and the two-dimensional flexible platform 5, the gantry X-axis platform 2 is set on the platform base 1, and the gantry Y-axis platform 3 is set On the gantry X-axis platform 2, the gantry Z-axis platform 4 is set on the gantry Y-axis platform 3, and the two-dimensional flexible platform 5 is set on the gantry Z-axis platform 4; the gantry X-axis platform 2, the gantry Y-axis platform 3 and the gantry Z The axis platforms 4 work together to drive the two-dimensional flexible platform 5 to move in three-dimensiona...

Embodiment 2

[0085] Based on the chip mass transfer device of the aforementioned embodiment 1, this embodiment also provides a chip transfer method of the chip mass transfer device, which specifically includes the following steps:

[0086] Step 1: Control the spinner head to perform the first intermittent movement with Ta as the period, and control the crystal film to perform the second intermittent movement with Ta as the period, wherein the first intermittent movement includes the spinner head moving from the previous chip substrate to the second intermittent movement. The top of the base moves to the top of the next base of the chip substrate; the second intermittent movement includes moving the next chip on the crystal film to the top of the next base; wherein, the first Both the intermittent movement and the second intermittent movement are included within a specified time period Tp, the spinner head, the next chip and the next base are aligned in the XY direction and relatively statio...

Embodiment 3

[0117] Figure 16 The mass chip transfer device shown will figure 1 The gantry X-axis platform 2 performing X-direction movement in the equipment shown in is replaced by the gantry axis fixed connection seat 2a, so that the gantry Y-axis platform 3 and the base 1 are fixedly connected. Figure 16 The chip transfer step 4 of the extended embodiment shown becomes "after the transfer of a single row of chips on the chip substrate is completed, the substrate feeding platform 8 drives the chip substrate to move, so that the spinner head is aligned with the subsequent row on the chip substrate, and the crystal film The macro-motion platform 7 drives subsequent rows of chips to be transferred on the crystal film to be aligned with subsequent rows on the chip substrate.”

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Abstract

The present application provides a chip mass transfer method and chip mass transfer equipment. The chip transfer method includes: controlling the spinner head to perform the first intermittent movement with Ta as the period, and controlling the crystal film to perform the second intermittent movement with Ta as the period, wherein , the first intermittent motion includes the spin crystal head moving from above the last base of the chip substrate to the top of the next base of the chip substrate; the second intermittent motion includes moving the next chip on the crystal film to the next base above; where the first intermittent motion and the second intermittent motion are included in the specified time period Tp, the spin crystal head, the next chip and the next base are aligned in the XY direction and relatively stationary; in the specified time period In Tp, the spinner head is driven by the Z-axis motor to transfer the next chip to the next base. This application adopts rigid-flexible compound motion technology, and the composite speed is an intermittent motion mode, which avoids the low efficiency of short-distance rapid start and stop and the wear of guide rails.

Description

technical field [0001] The present application relates to the technical field of semiconductors, in particular to a chip mass transfer method and chip mass transfer equipment. Background technique [0002] Chip transfer is one of the important equipment in the field of semiconductor packaging represented by LED. Its main function is to realize the transfer of semiconductor chips from the crystal film to the substrate. With the progress of the chip manufacturing process, the existing chip transfer equipment has been difficult to meet the latest requirements in terms of precision and production efficiency. [0003] At present, the mature methods are die-bonding and spin-bonding. Die-bonding uses a swing arm to quickly position on the wafer chip, picks up the chip with the help of a thimble, quickly positions it on the pad, and completes the chip placement with a certain bonding force. Spike crystal is a solution that combines flip chip and thimble. The wafer with the chip ups...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/68H01L33/00
CPCH01L21/67144H01L21/68H01L33/0095
Inventor 杨志军白有盾李瑞奇彭皓
Owner FOSHAN HUADAO SUPER PRECISION TECH CO LTD