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Method and device for detecting reliability of flash memory chip

A flash memory chip and detection method technology, applied in reliability/availability analysis, error detection/correction, static memory, etc., can solve problems such as insufficient information, and achieve the effect of improving production efficiency

Pending Publication Date: 2022-02-22
YEESTOR MICROELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In order to solve the cumbersome process of connecting the PC terminal to obtain detailed information due to insufficient information provided by the existing RDT test stand, and improve the production efficiency of the product, this application provides a detection method and detection device for the reliability detection of flash memory chips

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  • Method and device for detecting reliability of flash memory chip
  • Method and device for detecting reliability of flash memory chip
  • Method and device for detecting reliability of flash memory chip

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Embodiment Construction

[0050] The following is attached Figure 1-7 The application is described in further detail.

[0051] refer to figure 1 , the production process of solid-state drives (SSD) can be divided into K1 production stage, RDT production stage, K2 production stage, and K3 production stage. The K1 production stage refers to the practical MPTool burning RDT code into the flash memory chip. The K2 production stage refers to using MPTool for mass production of an SSD product, using the bad block information analyzed in the RDT stage to generate a corresponding bad block table, and the SSD mass-produced through the K2 production stage is a usable SSD solid state drive. The K3 production stage refers to the SSD solid-state hard disk that has been mass-produced in the K2 production stage. After the customer test stage, the "blocks" in the flash memory chip have been worn out, and new bad blocks may be generated. When the SSD is delivered to the customer, it needs to It is an unused factory ...

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Abstract

The invention relates to a method and a device for detecting the reliability of a flash memory chip, and belongs to the technical field of solid-state storage detection. The method comprises the following steps: installing a flash memory chip in a test frame; burning an RDT code into the flash memory chip by using an MPTool; inserting the flash memory chip successfully burnt with the RDT code into a power supply interface in a high-temperature box together with the test frame; powering on a SATA power supply interface, so as to enable BOOT of a SATA chip to load the RDT code into a RAM of the SATA chip from the flash memory chip; after the SATA chip is loaded, starting to enter an RDT offline scanning process; scanning, by the SATA chip, the flash memory chip, in order to find out bad blocks in the flash memory chip and generate bad block information; calculating, by the SATA chip, the particle quality of the flash memory chip by analyzing the bad block information, and dividing particle quality grades of the flash memory chip; prompting, by the SATA chip, a corresponding particle quality grade of the flash memory chip through a driving prompt unit. The invention has the effect of improving the production efficiency of products.

Description

technical field [0001] The present application relates to the technical field of solid-state storage testing, in particular to a testing method and testing device for reliability testing of flash memory chips. Background technique [0002] Flash memory (Flash), also known as flash memory, is a form of electronically programmable read-only memory that allows it to be erased or written multiple times during operation, and is non-volatile. In the field of solid-state storage, fixed hard disk (SSD) with flash memory as the storage medium is widely used in computer storage devices, and the quality of the flash memory particles on the solid-state hard disk determines the stability of the solid-state hard disk. [0003] A flash memory chip is composed of two or more dies (also known as chips), and a die can be divided into multiple Planes, and each Plane contains multiple Blocks, and each Block is divided into multiple Pages, and Dies are packaged to form particles. Therefore, a ...

Claims

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Application Information

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IPC IPC(8): G06F11/00G06F8/61G11C29/44
CPCG06F11/008G06F8/63G11C29/44
Inventor 吴耀虎黄衍军吴大畏李晓强韩国军
Owner YEESTOR MICROELECTRONICS CO LTD
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