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Rapid packaging device for light emitting diode

A technology for light-emitting diodes and packaging devices, which is applied to electrical components, circuits, semiconductor devices, etc., can solve the problems of light-emitting diodes being damaged by pulling force, unable to fix light-emitting diodes, and difficult to remove light-emitting diodes, etc. The effect of shifting and improving production efficiency

Active Publication Date: 2022-03-08
江苏晶曌半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, as far as the current traditional packaging device is concerned, most of its packaging molds are set in an integrated structure, which makes it difficult to take out the light emitting diode after the packaging is completed, and it is easy to cause the light emitting diode to be damaged to a certain extent due to excessive pulling force, and the existing The packaging device cannot effectively fix the light-emitting diode effectively, resulting in the displacement of the light-emitting diode during packaging; reducing the practicability of the packaging device

Method used

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  • Rapid packaging device for light emitting diode
  • Rapid packaging device for light emitting diode
  • Rapid packaging device for light emitting diode

Examples

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Embodiment 1

[0029] Example 1: Please refer to Figure 1 to Figure 12 :

[0030] The present invention proposes a rapid packaging device for light-emitting diodes, including: a support body 1, the support body 1 includes: a support table 101, a support frame 102, a connecting groove 103 and a support column 104, and the support table 101 is fixedly arranged on the support body 1 top; the support frame 102 is fixedly arranged on the top of the support platform 101, and the main body of the support frame 102 is set as a U-shaped structure; the number of the support frame 102 is set to two groups; the connecting groove 103 is opened inside the support frame 102, and the number of the connecting groove 103 is set There are three groups; the connecting groove 103 completely runs through the support frame 102; the support column 104 is fixedly arranged between two sets of support frames 102, and the number of support columns 104 is set to two groups; the main body of the support body 1 is set as...

Embodiment 2

[0034] Example 2: Please refer to Figure 13; In the present embodiment, mold mechanism 2 comprises: mold table 201, double-ended screw rod 202, connection block 203, mold parts 204, auxiliary hole 205, baking frame 206, fixed block 207, fixed rod 208 and synchronous wheel A209, mold The table 201 is fixedly arranged on the top of the support table 101, and two sets of square grooves are provided inside the mold table 201; the outer side of the double-ended screw 202 is fitted with bearings, and the bearings are fitted inside the mold table 201; the top of the double-ended screw 202 is fixedly provided with Synchronous wheel, and the number of double-ended screws 202 is set to two groups; the connecting block 203 is arranged on both sides of the double-ended screw rod 202 through threaded connection, and the number of connecting blocks 203 is set to four groups; the two groups of connecting blocks 203 are arranged as a symmetrical structure The mold parts 204 are fixedly arran...

Embodiment 3

[0035] Example 3: Please refer to Figure 14 In this embodiment, the glue filling mechanism 7 includes: glue filling frame 701, glue filling head 702, connecting pipe 703, screw rod 704, bevel gear C705, positioning rod 706 and positioning cylinder 707, and glue filling frame 701 passes through the hydraulic rod Fixedly installed at the bottom of the supporting column 104; the glue filling head 702 is fixedly installed inside the glue filling frame 701, and the glue filling head 702 is fixed in a path array; the connecting pipe 703 is fixedly arranged on the top of the glue filling head 702, and the connecting pipe 703 is connected to the telescopic soft The tubes 605 are connected; the outer side of the screw rod 704 is fitted with bearings, and the bearings are fitted inside the two ends of the connecting pipe 703; the top of the screw rod 704 is fixedly equipped with a bevel gear; the bevel gear C705 is fixedly set on the shaft end of the motor device, and The motor device ...

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Abstract

The invention provides a rapid packaging device for a light emitting diode, and relates to the technical field of light emitting diodes, the rapid packaging device comprises a support main body, the top of the support main body is provided with a mold mechanism, and the top of the support main body is provided with a control mechanism; a fixing device is installed on the top side of the supporting body, and an auxiliary mechanism is installed on the top side of the supporting body. A connecting mechanism is mounted at the top of the fixing device; compared with a traditional packaging device, the LED packaging device has the advantages that the design of a packaging mold is more flexible, the problem of an integrated structure of the traditional device is avoided, a packaged LED can be taken out quickly and simply, the LED can be effectively fixed, and the LED is prevented from shifting; the problems that the light-emitting diode is not easy to take out after being packaged, and an existing packaging device cannot effectively fix the light-emitting diode are solved.

Description

technical field [0001] The invention relates to the technical field of light-emitting diodes, in particular to a rapid packaging device for light-emitting diodes. Background technique [0002] Light-emitting diode is a commonly used light-emitting device. It releases energy and emits light through the recombination of electrons and holes. It is widely used in the field of lighting. Light-emitting diodes can efficiently convert electrical energy into light energy and have a wide range of uses in modern society, such as lighting, Flat panel displays, medical devices, etc.; during the processing of light-emitting diodes, corresponding packaging devices need to be used for packaging. [0003] However, as far as the current traditional packaging device is concerned, most of its packaging molds are set in an integrated structure, which makes it difficult to take out the light emitting diode after the packaging is completed, and it is easy to cause the light emitting diode to be da...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/52B29C39/10B29C39/26B29C39/38B29C39/24B29B7/18B29C33/12
CPCH01L33/52B29C39/10B29C39/26B29C39/38B29C39/24B29B7/18B29C33/12H01L2933/005
Inventor 白俊春
Owner 江苏晶曌半导体有限公司
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