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A rapid packaging device for light-emitting diodes

A technology for light-emitting diodes and packaging devices, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of damage to the pulling force of light-emitting diodes, failure to fix light-emitting diodes, and reduce the practicability of packaging devices, etc., to achieve flexible design of packaging molds, Prevents displacement and improves productivity

Active Publication Date: 2022-06-24
江苏晶曌半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, as far as the current traditional packaging device is concerned, most of its packaging molds are set in an integrated structure, which makes it difficult to take out the light emitting diode after the packaging is completed, and it is easy to cause the light emitting diode to be damaged to a certain extent due to excessive pulling force, and the existing The packaging device cannot effectively fix the light-emitting diode effectively, resulting in the displacement of the light-emitting diode during packaging; reducing the practicability of the packaging device

Method used

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  • A rapid packaging device for light-emitting diodes
  • A rapid packaging device for light-emitting diodes
  • A rapid packaging device for light-emitting diodes

Examples

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Effect test

Embodiment 1

[0029] Example 1: Please refer to Figure 1 to Figure 12 :

[0030] The present invention provides a fast packaging device for light emitting diodes, comprising: a support body 1, the support body 1 includes: a support table 101, a support frame 102, a connecting groove 103 and a support column 104, and the support table 101 is fixedly arranged on the support body 1. The top; the support frame 102 is fixedly arranged on the top of the support table 101, and the main body of the support frame 102 is set to a U-shaped structure; The connecting groove 103 completely penetrates the support frame 102; the support column 104 is fixedly arranged between the two sets of support frames 102, and the number of the support column 104 is set to two groups; A mold mechanism 2 is installed on the top; a control mechanism 3 is installed on the top of the support body 1, and a fixing device 4 is installed on the top side of the support body 1; the control mechanism 3 includes: a control shaft...

Embodiment 2

[0034] Example 2: Please refer to Figure 13; In this embodiment, the mold mechanism 2 includes: a mold table 201, a double-ended screw 202, a connecting block 203, a mold piece 204, an auxiliary hole 205, a baking rack 206, a fixed block 207, a fixed rod 208 and a synchronous wheel A209, the mold The table 201 is fixedly arranged on the top of the support table 101, and two sets of square grooves are opened inside the mold table 201; the outer side of the double-ended screw 202 is fitted with a bearing, and the bearing is fitted inside the mold table 201; the top of the double-ended screw 202 is fixedly provided with a bearing. Synchronizing wheel, and the number of double-ended screws 202 is set to two groups; the connecting blocks 203 are arranged on both sides of the double-ended screw 202 through screw connection, and the number of connecting blocks 203 is set to four groups; the two groups of connecting blocks 203 are arranged in a symmetrical structure The mold piece 20...

Embodiment 3

[0035] Example 3: Please refer to Figure 14 ; In this embodiment, the glue filling mechanism 7 includes: glue filling frame 701, glue filling head 702, connecting pipe 703, screw rod 704, bevel gear C705, positioning rod 706 and positioning cylinder 707, glue filling frame 701 through hydraulic rod The glue filling head 702 is fixedly arranged at the bottom of the support column 104; the glue filling head 702 is fixedly arranged inside the glue filling frame 701, and the glue filling head 702 is fixed in a path array; the connecting pipe 703 is fixedly arranged on the top of the glue filling head 702, and the connecting tube 703 is connected with the telescopic soft The tube 605 is connected; the outer side of the screw rod 704 is fitted with a bearing, and the bearing is fitted inside both ends of the connecting tube 703; the top of the screw rod 704 is fixedly provided with a bevel gear; the bevel gear C705 is fixedly arranged at the shaft end of the motor device, and The m...

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Abstract

The invention provides a quick packaging device for light-emitting diodes, which relates to the technical field of light-emitting diodes, comprising: a support body, a mold mechanism is installed on the top of the support body, and a control mechanism is installed on the top of the support body; A fixing device is installed on the side, and an auxiliary mechanism is installed on the top side of the supporting body; a connecting mechanism is installed on the top of the fixing device; a glue filling mechanism is installed on the bottom of the auxiliary mechanism. Compared with the traditional packaging device, the packaging mold design is more flexible , which avoids the problem of the integrated structure of the traditional device, can quickly and simply take out the packaged light-emitting diode, and can effectively fix the diode to prevent the light-emitting diode from shifting; solves the problem that the light-emitting diode is not easy to take out after the package is completed, And the problem that the existing packaging device cannot effectively fix the light emitting diode.

Description

technical field [0001] The present invention relates to the technical field of light emitting diodes, in particular to a rapid packaging device for light emitting diodes. Background technique [0002] Light-emitting diode is a commonly used light-emitting device. It emits energy through the recombination of electrons and holes. It is widely used in the field of lighting. Light-emitting diodes can efficiently convert electrical energy into light energy. Flat panel displays, medical devices, etc.; in the process of processing light-emitting diodes, corresponding packaging devices need to be used for packaging. [0003] However, as far as the current traditional packaging devices are concerned, the packaging molds are mostly set in an integrated structure, which makes it difficult to take out the light-emitting diodes after the packaging is completed. The packaged device cannot effectively fix the light-emitting diode, which leads to the phenomenon of displacement of the light...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/52B29C39/10B29C39/26B29C39/38B29C39/24B29B7/18B29C33/12
CPCH01L33/52B29C39/10B29C39/26B29C39/38B29C39/24B29B7/18B29C33/12H01L2933/005
Inventor 白俊春
Owner 江苏晶曌半导体有限公司
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