Wafer expanding system for semiconductor

Abstract

The invention discloses a semiconductor wafer expanding system which comprises a machine shell, a power cavity is formed in the machine shell, two belt wheel cavities are symmetrically formed in the end faces of the left side and the right side of the power cavity, an off-axis wheel cavity is formed in the lower end wall of the power cavity, and a wafer expanding mechanism, an auxiliary mechanism and a transmission mechanism are arranged in the machine shell. The auxiliary mechanism can complete auxiliary work such as heating and blue film pasting in the wafer expansion process, the transmission mechanism can provide power for the wafer expansion mechanism and the auxiliary mechanism, and the wafer position can be adjusted through a centralizing plate which is arranged in the wafer expansion mechanism and can move horizontally. The auxiliary mechanism is provided with the placing cavity, so that the wafer is located in the middle of the placing cavity during wafer expansion, the wafer is automatically covered by the blue film and the wafer expansion quality is ensured through the unwinding wheel which is arranged in the auxiliary mechanism and can automatically rotate to discharge and roll materials, and the blue film is automatically cut through the cutting knife which is arranged in the wafer expansion mechanism and can rotate to cut the blue film.

Description

technical field [0001] The present application relates to the technical field of wafer expansion, in particular to a semiconductor wafer expansion system. Background technique [0002] In order to facilitate the cutting and mounting of wafers, after the wafer components leave the factory, the wafer components need to be expanded. During the process of wafer expansion, the surface of the wafer needs to be covered with a layer of blue film. It is inevitable that the blue film will be folded during the process, which will affect the surface quality of the wafer. At the same time, it is impossible to guarantee whether the wafer will be damaged when cutting the blue film. The existing wafer expansion device has a complex structure and is inconvenient to use, resulting in low expansion efficiency. Contents of the invention [0003] In order to solve the above problems, the present invention is achieved through the following technical solutions: [0004] A wafer expansion system...

AI Technical Summary

Problems solved by technology

[0002] In order to facilitate the cutting and mounting of wafers, after the wafer components leave the factory, the wafer components need to be expanded. During the process of wafer expansion, the surface of the wafer needs to be covered with a layer of blue film. It is inevitable that the blue film will be folded during the process, which will affect the surface quality of the wafer. At the same time, it is impossible to guarantee whether the wafer will be damaged when cutting the blue film. The existing wafer expansion device has a complex structure and is inconvenient to use, resulting in low expansion efficiency.

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