Size detection method, device and equipment and computer readable storage medium

Abstract

The invention discloses a size detection method and a related device. The size detection method comprises the following steps: obtaining a detection image of a to-be-detected piece by size detection equipment; determining a to-be-detected area in the detection image according to the template image; obtaining a gray level histogram of the to-be-detected area; determining a binary gray value according to the gray histogram; binarizing the detection image according to the binarized gray value to obtain a binary image; for the number of feature pixel points in each row of the binary image along the first direction and each column of the binary image along the second direction, wherein the first direction is perpendicular to the second direction; and determining the size of the to-be-detected area according to the number of the feature pixel points of the binary image along the first direction and the second direction. Through the size detection method, the size of the to-be-detected area on the to-be-detected piece can be accurately determined, so that the size of the to-be-detected piece can be conveniently detected, the situation that the to-be-detected piece is not accurately detected due to the fact that the size is too large or too small is avoided, and the problem that the detection efficiency of the to-be-detected piece is reduced is solved.

Description

technical field [0001] The present application relates to the technical field of detection, and in particular to a size detection method, device, equipment and computer-readable storage medium. Background technique [0002] In the process of inspecting the wafer, before detecting the defects on the wafer surface, it is first necessary to detect the size of different functional areas on the wafer surface. After confirming that the sizes of different functional areas on the wafer meet the requirements, the The defects in the functional area of ​​the wafer are detected. When the size of the functional area of ​​the wafer is detected, when the pictures taken are processed, when the judgment is made based on the processed pictures, it is often impossible to accurately judge the functional area. As a result, the judgment of the size of the functional area is inaccurate, and the products with unqualified functional area size flow into the subsequent process, which affects the detec...

AI Technical Summary

Problems solved by technology

[0002] In the process of inspecting the wafer, before detecting the defects on the wafer surface, it is first necessary to detect the size of different functional areas on the wafer surface. After confirming that the sizes of different functional areas on the wafer meet the requirements, the The defects in the functional area of ​​the wafer are detected. When the size of the functional area of ​​the wafer is detected, when the pictures taken are processed, when the judgment is made based on the processed pictures, it is often impossible to accurately judge the functional area. As a result, the judgment of the size of the functional area is inaccurate, and the products with unqualified functional area size flow into the subsequent process, which affects the detection efficiency of the DUT and reduces the detection accuracy of the DUT

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