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Electronic device and manufacturing method thereof

A technology of electronic devices and manufacturing methods, which is applied in the direction of printed circuit manufacturing, circuits, printed circuits, etc., can solve the problems of difficult fluid control, defects, and electronic components not being installed, and achieve the effect of improving process efficiency

Pending Publication Date: 2022-05-03
INNOLUX CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, because the fluid is not easy to control, the stability of the fluid assembly process needs to be improved. For example, some electronic components may not be installed in the unit area (pixel) on the drive substrate and cause defects.

Method used

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  • Electronic device and manufacturing method thereof
  • Electronic device and manufacturing method thereof
  • Electronic device and manufacturing method thereof

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Embodiment Construction

[0014] The present invention can be understood by referring to the following detailed description and in conjunction with the accompanying drawings. It should be noted that, in order to make the readers easy to understand and the drawings are concise, the multiple drawings in the present invention only draw electronic devices (in the present invention is a part of the electronic device), and at least some of the specific elements in the drawings are not drawn according to actual scale. In addition, the quantity and size of each element in the figure are only for illustration, and are not intended to limit the scope of the present invention.

[0015] Certain terms will be used throughout the specification and claims to refer to particular elements. Those skilled in the art should understand that electronic device manufacturers may refer to the same element by different names. This document does not intend to distinguish between those elements that have the same function but ha...

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Abstract

The invention provides an electronic device and a manufacturing method thereof, and the electronic device comprises a driving substrate which comprises a plurality of circular grooves, a plurality of square grooves and a plurality of dish-shaped electronic elements. At least one disc-shaped electronic component of the plurality of disc-shaped electronic components is positioned in at least one circular groove of the plurality of circular grooves, the at least one disc-shaped electronic component comprises an alignment element positioned on a top surface of the at least one disc-shaped electronic component, and a diameter of the at least one disc-shaped electronic component is defined as R, the diameter of the alignment element is defined as r, the width of at least one square groove in the plurality of square grooves is defined as W, the height of the at least one square groove is defined as H, and the at least one dish-shaped electronic element and the at least one square groove meet the conditions.

Description

technical field [0001] The present invention relates to an electronic device, in particular to a method for assembling electronic components by means of fluid assembly to manufacture the electronic device. Background technique [0002] Electronic components, as essential components of electronic devices or light emitting devices, are widely used in electronic products, such as mobile phones, tablet computers, car displays, and the like. After the circuit of the driving substrate of the electronic device or the light-emitting device is fabricated, a fluid assembly program can be used to mount a large number of electronic components on the driving substrate. However, because the fluid is not easy to control, the stability of the fluid assembly process needs to be improved. For example, some electronic components may not be installed on the pixel of the driving substrate and cause defects. Therefore, it is necessary to provide a repairing method for electronic components, so a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/15H01L27/32
CPCH01L27/156H10K59/12H01L25/0753H01L33/20H01L2224/95136H01L33/0095H01L24/95H01L2924/12041H01L2924/15153H01L2924/12044H01L2224/83191H01L2224/2929H01L2224/293H01L2224/95085H01L2924/10156H01L2224/95001H01L2224/95H01L24/29H01L24/32H01L2224/32225H01L24/83H01L25/50H01L2224/75705H01L2224/8314H01L2224/83141H01L2224/83002H01L2224/95101H01L33/38H01L2924/00014H01L2924/00012H01L2224/83H05K1/181H05K3/303H05K2201/10106H05K2201/10166H05K2201/10174H01L33/005H01L33/24
Inventor 林俊贤
Owner INNOLUX CORP