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PCB easy to test and electronic equipment

A technology for PCB boards and test circuits, which is applied in the directions of printed circuits, printed circuits, and electrical components connected to non-printed electrical components, which can solve problems such as unavailability, production difficulties, and inability to detect back-drilling offsets. , to achieve the effect of convenient judgment

Pending Publication Date: 2022-05-06
APCB ELECTRONICS SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the production process, it is impossible to detect whether the offset of the back drilling is appropriate, and it cannot be well monitored, causing great troubles to production

Method used

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  • PCB easy to test and electronic equipment
  • PCB easy to test and electronic equipment
  • PCB easy to test and electronic equipment

Examples

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0025] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0026] In addition, the descriptions i...

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Abstract

The invention discloses a PCB easy to test, which comprises a body with a copper deposition hole, and is characterized in that the body comprises a plurality of layers of material plates arranged in a laminated manner and a test structure embedded in the material plates; the test structure comprises a plurality of test circuits capable of being directly connected with a test instrument, the plurality of test circuits sequentially surround the outer wall of the electroless plating copper hole in the axial direction of the electroless plating copper hole, the plurality of test circuits are embedded in the material plate, and the widths of the plurality of test circuits are sequentially increased. The test structure comprises a plurality of test circuits with different widths, so that when a back drilling hole is formed in the electroless plating copper hole, the test circuits are possibly cut off because the test circuits surround the outer wall of the electroless plating copper hole, the test circuits with larger widths are less likely to be cut off, the test circuits are tested by a test instrument, and the circuit break indicates that the test circuits are cut off; the test circuit is not cut off if the open circuit does not occur, and the offset of the back drilling hole can be conveniently judged by judging the on-off of the test circuit.

Description

technical field [0001] The invention relates to the technical field of PCB board processing, in particular to an easy-to-test PCB board and an electronic device. Background technique [0002] The PCB board usually has a multi-layer material board, and through holes are opened on the PCB board, and copper sinking treatment is performed on the through holes to form sinking copper holes, and then the multi-layer material boards are electrically connected through the sinking copper holes. [0003] The research shows that the main factors affecting the signal integrity of the signal system of the PCB board include design, material, transmission line, connector, chip packaging and other factors. The sinking copper hole has a great influence on the signal integrity. The sinking copper section that does not play any role in connection or transmission can avoid reflection, scattering, delay, etc. of high-speed signal transmission, which will bring "distortion" to the signal, [0004...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/18
CPCH05K1/0266H05K1/183
Inventor 陈广牛俊杰
Owner APCB ELECTRONICS SHENZHEN CO LTD