Manufacturing method of simple slapper assembly

A manufacturing method and technology of impact sheet, which are applied in the directions of manufacturing tools, weapon accessories, offensive equipment, etc., can solve the problem of increasing the difficulty of assembling an explosive foil component and a ceramic plug component, restricting the development of in-line ignition and detonation systems, and the large volume of impact sheet components. and other problems, to achieve the effect of good film thickness uniformity, avoiding the risk of dislocation, and easy mass production

Pending Publication Date: 2022-05-24
NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the manufacturing of domestic impact plate components is limited by the separate assembly of explosive foil components, which is difficult to achieve mass production, and is expensive and poor in consistency.
On the other hand, the traditional explosive foil pads are generally on the same side as the bridge area, which increases the difficulty of assembling the explosive foil assembly and the ceramic plug assembly, and the shock plate assembly is also relatively large, which has long restricted the development of in-line ignition and detonation systems in China.

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  • Manufacturing method of simple slapper assembly
  • Manufacturing method of simple slapper assembly
  • Manufacturing method of simple slapper assembly

Examples

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Effect test

Embodiment 1

[0034] Embodiment 1, a manufacturing method of a simple impact plate assembly, including making an explosive foil assembly and a ceramic plug assembly respectively, and the manufacturing method of the explosive foil assembly includes the following steps:

[0035] Step 1: Manufacture the substrate 2 with the metal solid hole 3, and the specific manufacturing steps are as follows:

[0036] Step 101: Select a clean substrate 2, the substrate 2 can be an alumina substrate or a sapphire substrate, the thickness is 0.2-0.8 mm, and the through holes arranged according to the cell array are processed on the substrate 2 by laser etching, and the through hole diameter is 0.05mm~0.2mm..

[0037] Step 101 : ultrasonically clean the substrate 2 to remove residues on the edges of the through holes;

[0038] Step 103: Using a magnetron sputtering process, deposit a composite metallization layer on the surface of the substrate 2 and the inner wall of the through hole. The composite metalliz...

Embodiment 2

[0048] Embodiment 2, a manufacturing method of a simple impact plate assembly, including making an explosive foil assembly and a ceramic plug assembly respectively, and the manufacturing steps of the explosive foil assembly are as follows:

[0049] Step 1: Manufacture the substrate 2 with the metal solid hole 3, and the specific manufacturing steps are as follows:

[0050] Step 101: Select a clean 99.6% alumina ceramic substrate, use nanosecond laser etching, and process 5 through holes with a diameter of 0.1mm at the corresponding position of each pad 1;

[0051] Step 102 : cleaning the through-hole substrate 2 to remove the residue on the edge of the through-hole;

[0052] Step 103: Using a magnetron sputtering system, deposit WTi / Cu as a seed layer, and the thickness of Cu is 1 μm;

[0053] Step 104 : electroplating Cu by the electroplating solid hole process, and using Cu to fill the through hole into the metal solid hole 3 , then the position of the metal solid hole 3 is...

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Abstract

The invention discloses a method for manufacturing a simple slapper assembly in the field of ignition detonation, which comprises the following steps of: 1, manufacturing a base plate with a metal solid hole, depositing a transduction element layer on the front surface of the base plate, depositing a welding layer on the back surface of the base plate, and manufacturing a ceramic plug assembly on the ceramic plug assembly; processing a transduction element pattern on the transduction element layer, and processing a bonding pad on the welding layer; 2, a polymer film is attached to the surface of the transduction element pattern to serve as a flyer layer; 3, an AuSn solder is preset on the flyer layer; 4, a ceramic acceleration chamber is machined, specifically, the ceramic acceleration chamber is welded to the flyer layer, and exploding foil assembly machining is completed; and the exploding foil assembly is welded to the surface of the ceramic plug assembly through the PbSn reflow soldering technology, and machining of the impact piece assembly is completed. The bonding pad of the exploding foil assembly is transferred to the back surface of the substrate, and is assembled with the ceramic plug by adopting a reflow soldering process, so that convenience is provided for subsequent assembly, and the method is suitable for batch production.

Description

technical field [0001] The invention relates to the field of ignition and detonation, in particular to a manufacturing method of a simple impact sheet assembly. Background technique [0002] As the safest and most advanced insensitive pyrotechnics, the in-line ignition and detonation system is widely used in various weapons and equipment. The impact plate assembly is the core component of the in-line detonation system, which converts electrical energy into kinetic energy, and ignites the insensitive explosive through the high-speed impact and friction of the flying plate, realizing the precise control and high reliability of the ignition and detonation functions of the system. At present, the manufacture of domestic impact plate components is subject to the separate assembly of explosive foil components, which is difficult to mass-produce, and is expensive and has poor consistent performance. On the other hand, the traditional explosive foil pad is generally on the same sid...

Claims

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Application Information

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IPC IPC(8): F42B3/195B23P15/00B23K26/362B23K26/382B23K26/70
CPCF42B3/195B23P15/00B23K26/362B23K26/382B23K26/702
Inventor郑国强姚艺龙丁小聪李鸿高汪涛
OwnerNO 43 INST OF CHINA ELECTRONICS TECH GRP CETC