Manufacturing method of simple slapper assembly
A manufacturing method and technology of impact sheet, which are applied in the directions of manufacturing tools, weapon accessories, offensive equipment, etc., can solve the problem of increasing the difficulty of assembling an explosive foil component and a ceramic plug component, restricting the development of in-line ignition and detonation systems, and the large volume of impact sheet components. and other problems, to achieve the effect of good film thickness uniformity, avoiding the risk of dislocation, and easy mass production
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Embodiment 1
[0034] Embodiment 1, a manufacturing method of a simple impact plate assembly, including making an explosive foil assembly and a ceramic plug assembly respectively, and the manufacturing method of the explosive foil assembly includes the following steps:
[0035] Step 1: Manufacture the substrate 2 with the metal solid hole 3, and the specific manufacturing steps are as follows:
[0036] Step 101: Select a clean substrate 2, the substrate 2 can be an alumina substrate or a sapphire substrate, the thickness is 0.2-0.8 mm, and the through holes arranged according to the cell array are processed on the substrate 2 by laser etching, and the through hole diameter is 0.05mm~0.2mm..
[0037] Step 101 : ultrasonically clean the substrate 2 to remove residues on the edges of the through holes;
[0038] Step 103: Using a magnetron sputtering process, deposit a composite metallization layer on the surface of the substrate 2 and the inner wall of the through hole. The composite metalliz...
Embodiment 2
[0048] Embodiment 2, a manufacturing method of a simple impact plate assembly, including making an explosive foil assembly and a ceramic plug assembly respectively, and the manufacturing steps of the explosive foil assembly are as follows:
[0049] Step 1: Manufacture the substrate 2 with the metal solid hole 3, and the specific manufacturing steps are as follows:
[0050] Step 101: Select a clean 99.6% alumina ceramic substrate, use nanosecond laser etching, and process 5 through holes with a diameter of 0.1mm at the corresponding position of each pad 1;
[0051] Step 102 : cleaning the through-hole substrate 2 to remove the residue on the edge of the through-hole;
[0052] Step 103: Using a magnetron sputtering system, deposit WTi / Cu as a seed layer, and the thickness of Cu is 1 μm;
[0053] Step 104 : electroplating Cu by the electroplating solid hole process, and using Cu to fill the through hole into the metal solid hole 3 , then the position of the metal solid hole 3 is...
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