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Credit debt risk analysis method and device

A technology of risk analysis and credit debt, applied in the financial field, can solve problems such as investor losses

Pending Publication Date: 2022-06-17
BANK OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, there are three main types of bonds in the bond market, interest rate bonds, convertible bonds and credit bonds. Compared with interest rate bonds, credit bonds have credit risks, that is, borrowers, securities issuers or counterparties are unwilling or unable to perform due to various reasons. The possibility of breach of contract due to contract conditions, resulting in losses for investors
When a credit explosion occurs in credit bonds, it usually causes huge losses to investors

Method used

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  • Credit debt risk analysis method and device
  • Credit debt risk analysis method and device
  • Credit debt risk analysis method and device

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Embodiment Construction

[0032] In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Here, the exemplary embodiments of the present invention and their descriptions are used to explain the present invention, but not to limit the present invention.

[0033] In the description of this specification, the use of "comprising", "including", "having", "containing" and the like are all open-ended terms, that is, meaning including but not limited to. Description with reference to the terms "one embodiment", "one particular embodiment", "some embodiments", "for example" etc. means that a particular feature, structure or characteristic described in connection with the embodiment or example is included in at least one of the present application examples or examples. In this specification, schematic representations of the ...

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Abstract

The invention provides a credit debt risk analysis method and device, which can be used in the technical field of finance, and the method comprises the steps: obtaining credit debt market transaction price data and debt estimation data in credit debts; calculating credit debt market transaction price fluctuation data according to the credit debt market transaction price data; according to the credit debt market transaction price data and the debt estimation data in the credit debt, calculating debt estimation deviation data in credit debt market transaction price comparison; calculating debt estimation fluctuation data in the credit debt according to debt estimation data in the credit debt; and according to the credit debt market transaction price fluctuation data, the debt estimation deviation data in credit debt market transaction price comparison and the debt estimation fluctuation data in the credit debt, determining the early warning level of the early warning credit debt when the credit debt is determined to be the early warning credit debt. According to the invention, the risk of the credit debt can be analyzed.

Description

technical field [0001] The invention relates to the field of financial technology, and in particular, to a method and device for analyzing credit debt risk. Background technique [0002] As an important component of portfolio investment, bonds provide relatively stable returns and lower risks for the portfolio. The management of bond risks is a very important part of portfolio management. At present, among the three main types of bonds in the bond market, interest rate bonds, convertible bonds and credit bonds, credit bonds have credit risks compared with interest rate bonds, that is, the borrower, securities issuer or counterparty is unwilling or unable to perform due to various reasons. The conditions of the contract constitute a breach of contract, resulting in the possibility of investors suffering losses. When a credit explosion occurs in a credit bond, it usually causes huge losses to investors. How to identify and control the credit risk of credit bonds, and how to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06Q40/08G06Q40/06G06F17/18
CPCG06Q40/08G06Q40/06G06F17/18
Inventor 高娜王浚懿平其峻金业
Owner BANK OF CHINA
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