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Display substrate, manufacturing method thereof and display device

A technology for display substrates and display areas, which is applied in semiconductor/solid-state device manufacturing, diodes, semiconductor devices, etc., can solve problems such as poor packaging of display panels, achieve good packaging effects, and improve packaging yields.

Pending Publication Date: 2022-06-21
MIANYANG BOE OPTOELECTRONICS TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the two technologies of the under-screen camera and the front camera are applied to the display panel at the same time, the problem of poor packaging of the display panel is prone to occur.

Method used

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  • Display substrate, manufacturing method thereof and display device
  • Display substrate, manufacturing method thereof and display device
  • Display substrate, manufacturing method thereof and display device

Examples

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Embodiment Construction

[0034] The technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, but not all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided by the present disclosure fall within the protection scope of the present disclosure.

[0035] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms such as the third person singular "comprises" and the present participle "comprising" are used It is interpreted as the meaning of openness and inclusion, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" example)" or "some examples" an...

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PUM

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Abstract

The invention discloses a display substrate, a manufacturing method thereof and a display device, relates to the technical field of display, and aims to improve the packaging yield of the display substrate. The display substrate is provided with a display area, a hole opening area and a transition area located between the display area and the hole opening area. The display substrate comprises a substrate, a driving circuit layer, at least one transparent conductive layer and a metal conductive layer. Wherein the driving circuit layer is positioned on one side of the substrate; the at least one transparent conductive layer is located on one side of the driving circuit layer away from the substrate; the metal conducting layer is located on the side, away from the driving circuit layer, of the transparent conducting layer and comprises a partition part located in the transition area. According to the display substrate provided by the invention, the metal conductive layer comprising the partition part is arranged on one side, far away from the driving circuit layer, of the transparent conductive layer, so that the partition part can be prevented from being etched for multiple times, the compactness of the packaging layer during deposition on the partition part can be ensured, a good wrapping effect on the partition part can be generated, and the packaging yield of the display substrate is improved.

Description

technical field [0001] The present disclosure relates to the field of display technology, and in particular, to a display substrate, a manufacturing method thereof, and a display device. Background technique [0002] In recent years, electronic devices require facial infrared recognition to be compatible with the front camera, that is, the two technologies of the under-screen camera and the front camera need to be applied to the display panel. [0003] However, when the two technologies of the under-screen camera and the front camera are applied to the display panel at the same time, the problem of poor packaging of the display panel is prone to occur. SUMMARY OF THE INVENTION [0004] The purpose of the present disclosure is to provide a display substrate, a manufacturing method thereof, and a display device, which are used to improve the packaging yield of the display substrate. [0005] In order to achieve the above object, the present disclosure provides the following...

Claims

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Application Information

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IPC IPC(8): H01L27/12H01L27/32H01L21/77
CPCH01L27/124H01L27/1259H10K59/60H10K59/65H10K59/131
Inventor 徐海峰唐庆曹鑫胡静涂杰刘晋捷雷鸣谢艳春
Owner MIANYANG BOE OPTOELECTRONICS TECH CO LTD