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Sealing mechanism and wafer reaction equipment

A technology of sealing mechanism and sealing plate, which is applied in the direction of mechanical equipment, engine components, valve operation/release devices, etc., can solve the problems of poor sealing accuracy, substandard sealing performance, and insufficient rigid movement, etc., and achieve good sealing performance, High sealing precision, better sealing performance

Active Publication Date: 2022-06-24
江苏邑文微电子科技有限公司 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the sealing mechanism that realizes rigid motion sealing on the market has the problem of poor sealing accuracy. Often the sealing performance is not up to standard due to insufficient rigid motion, or the hardware is damaged due to excessive rigid motion.

Method used

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  • Sealing mechanism and wafer reaction equipment
  • Sealing mechanism and wafer reaction equipment
  • Sealing mechanism and wafer reaction equipment

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Experimental program
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Embodiment

[0032] Please refer to figure 1 , figure 2 and image 3 , figure 1 A schematic structural diagram of the sealing mechanism 100 provided in this embodiment is shown, figure 2 shown as figure 1 A cross-sectional view of the sealing mechanism 100 is shown, image 3 shown as figure 2 Enlarged schematic diagram of region A in the middle.

[0033] The sealing mechanism 100 provided in this embodiment is applied to wafer reaction equipment, and has the characteristics of higher sealing precision and better sealing. The sealing mechanism 100 includes a door body 110 , a frame 120 , a sealing assembly 130 , an elastic member 140 , a screw rod 150 , a driving assembly 160 and a detection device 170 . The door body 110 is provided with an opening 111 , the elastic member 140 , and the driving assembly 160 . and the detection device 170 are arranged on the frame 120, the sealing assembly 130 is matched with the screw rod 150 through the ball, the screw rod 150 is provided with a...

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Abstract

The invention discloses a sealing mechanism and wafer reaction equipment, and relates to the technical field of semiconductors. The sealing mechanism comprises a door body, a rack, a sealing assembly, an elastic piece, a lead screw, a driving assembly and a detection device, an opening is formed in the door body in a penetrating mode, the elastic piece, the driving assembly and the detection device are all arranged on the rack, the sealing assembly is matched with the lead screw through a ball, a stop piece is arranged on the lead screw, and the elastic piece is used for abutting against the stop piece in the forward direction. The driving assembly is in transmission connection with the lead screw and used for driving the lead screw to rotate so as to drive the sealing assembly to move forwards to be attached to the door body to seal the opening, and the driving assembly is further used for driving the lead screw to continue to rotate under the condition that the sealing assembly is attached to the door body so that the lead screw can drive the stop piece to move reversely and compress the elastic piece. The detection device is used for detecting the position of the lead screw, and the driving assembly is further used for stopping when the detection device detects that the lead screw reversely moves to the preset position. The sealing mechanism provided by the invention has higher sealing precision and better sealing performance.

Description

technical field [0001] The present invention relates to the field of semiconductor technology, and in particular, to a sealing mechanism and wafer reaction equipment. Background technique [0002] Semiconductor equipment usually has higher requirements for sealing, and usually adopts rigid motion sealing for automatic sealing. [0003] At present, the sealing mechanism that realizes rigid motion sealing on the market has the problem of poor sealing accuracy. Often, the sealing performance is not up to standard due to insufficient rigid motion, or hardware damage is caused by excessive rigid motion. SUMMARY OF THE INVENTION [0004] The purpose of the present invention is to provide a sealing mechanism with higher sealing precision and better sealing performance. [0005] Another object of the present invention is to provide a wafer reaction device with higher sealing precision and better sealing performance. [0006] The present invention provides a technical scheme: ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16K1/00F16K1/44F16K1/46F16K31/04F16K31/50F16K31/53F16K37/00H01L21/67
CPCF16K1/00F16K1/44F16K1/46F16K31/047F16K31/50F16K31/53F16K37/0083H01L21/67
Inventor 戴建波孙文彬陆北源
Owner 江苏邑文微电子科技有限公司
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