Full-suspension type vibration isolation and shock isolation method and structure for electronic equipment

Abstract

The invention discloses a full-suspension type vibration isolation and shock isolation method and structure for electronic equipment, sensitive devices of the electronic equipment are respectively arranged in a closed shell in a full-suspension manner, and gaps between the sensitive devices and the inner wall of the shell are filled with pouring sealant; the connection relation between the components of the electronic equipment is completed before potting; the pouring sealant serves as a damping medium, the vibration transfer function of the pouring sealant meets the working requirement of an electronic product, and when the vibration impact excitation source is transferred to the sensitive device through the shell and the pouring sealant, vibration isolation and impact isolation of the electronic device are achieved under the damping effect of the pouring sealant. According to the invention, vibration or impact in three directions can be isolated, and internal devices of the electronic equipment are prevented from being influenced by an external mechanical environment.

Description

technical field [0001] The invention relates to the technical improvement of anti-vibration and shock of electronic equipment, in particular to a fully-suspended vibration-isolating and shock-isolating method and structure of electronic equipment, and belongs to the technical field of anti-vibration and shock of electronic products. Background technique [0002] Depending on the environment in which an electronic device is used, its internal components may be subject to vibration and shock from the external environment. Some devices are vibration-sensitive devices whose function or accuracy may be adversely affected by strong vibrations and high shocks. For example, the gyroscope and accelerometer in the inertial measurement unit are sensitive devices. Strong vibration or high shock of the external environment may change the internal structure of the device, resulting in other fault phenomena such as output saturation. Vibration or shock may occur in the X, Y and Z directio...

AI Technical Summary

Problems solved by technology

Especially for those electronic products that require high precision and are very sensitive to vibration and shock, if the problem of vibration and shock cannot be solved, it will directly affect the normal use of the product

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