Pump device
A technology for pump devices and fixing components, which is applied to pumps, pump elements, variable displacement pump components, etc., can solve problems such as peeling of the adhesive surface, and achieve the effect of suppressing the reduction of the adhesive state
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 Embodiment approach
[0017] The pump device according to the first embodiment of the present invention will be described with reference to the drawings. figure 1 It is a side cross-sectional view showing the configuration of the pump device according to the first embodiment of the present invention. figure 2 It is an exploded perspective view of the pump apparatus which concerns on 1st Embodiment of this invention. In addition, in each figure shown in each embodiment including this embodiment, the shape (dimension) of each component is exaggeratedly described in part or the whole for easy understanding of description.
[0018] like figure 1 , figure 2 As shown, the pump device 1 includes a piezoelectric pump 10 , an outer case 70 and an adhesive sheet 80 . The adhesive sheet 80 corresponds to the "adhesive member" of the present invention. The piezoelectric pump 10 and the outer case 70 are bonded by the adhesive sheet 80 . At this time, the discharge port 41 of the piezoelectric pump 10 co...
no. 2 Embodiment approach
[0060] A pump device according to a second embodiment of the present invention will be described with reference to the drawings. image 3 It is a side cross-sectional view showing the configuration of the pump device according to the second embodiment of the present invention.
[0061] like image 3 As shown, the pump device 1A according to the second embodiment is different from the pump device 1 according to the first embodiment in that it includes a metal 79A and a metal bonding material 78 . The other structures of the pump device 1A are the same as those of the pump device 1, and the description of the same parts is omitted.
[0062] The outer case 70A includes a metal 79A and a metal bonding material 78 . The metal 79A is bonded to the main surface 711 of the main board 71 via the metal bonding material 78 .
[0063] The metal 79A has a plate shape and is formed independently of the outer case 70A. The metal bonding material 78 is, for example, a thermosetting or ult...
no. 3 Embodiment approach
[0066] A pump device according to a third embodiment of the present invention will be described with reference to the drawings. Figure 4 It is a side cross-sectional view showing the configuration of the pump device according to the third embodiment of the present invention.
[0067] like Figure 4 As shown, the pump device 1B according to the third embodiment is different from the pump device 1 according to the first embodiment in that it includes the metal 79B. The other structures of the pump device 1B are the same as those of the pump device 1, and the description of the same parts is omitted.
[0068] The outer case 70B includes metal 79B. The metal 79B is exposed from the main surface 711 side of the main board 71 and buried in the main board 71 .
[0069] The metal 79B has a plate shape, and is embedded in the main plate 71 of the outer case 70B using, for example, insert molding or the like.
[0070] According to this structure, the main surface 711 of the main bo...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More