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Multilayered printed wiring board

A multi-layer printing and wiring board technology, applied in the direction of multi-layer circuit manufacturing, printed circuit parts, metal pattern materials, etc.

Inactive Publication Date: 2004-09-22
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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  • Multilayered printed wiring board

Examples

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Embodiment 1

[0021] In this embodiment, the power supply layer constituting the multilayer printed wiring board was formed as follows.

[0022] First, an interlayer insulating layer 2 made of a heat-resistant resin (PES) is formed on a substrate 1, and the surface of the interlayer insulating layer 2 is roughened with a potassium permanganate solution so that it becomes JIS-B0601Rz=6 microns Rough surface (see figure 1 (1)). In addition, the thickness of the interlayer insulating layer 2 after roughening is 35 microns.

[0023] Next, print the desired permanent resist (epoxy resin series) 3 pattern corresponding to the conductor pattern of the power supply layer on the surface of the above-mentioned interlayer insulating layer (refer to figure 1 (2)), by performing electroless copper plating, a power supply layer 4 with a grid-like conductor pattern is formed (refer to figure 1 (3)). Conductor width / resist width=250 μm / 250 μm in the grid structure of the power supply layer 4 along the ...

Embodiment 2

[0025] In this embodiment, the power supply layer constituting the multilayer printed wiring board was formed as follows.

[0026] First, an interlayer insulating layer 2 made of a heat-resistant resin (PES-epoxy resin series) is formed on the substrate 1, and the surface of the interlayer insulating layer 2 is roughened with a potassium permanganate solution to make it JIS- B0601 Rz = 6 micron rough surface (refer to figure 1 (1)). In addition, the thickness of the interlayer insulating layer 2 after roughening is 35 microns.

[0027] Next, print the desired permanent resist (epoxy resin series) 3 pattern corresponding to the conductor pattern of the power supply layer on the surface of the above-mentioned interlayer insulating layer (refer to figure 1 (2)), by performing electroless copper plating, a power supply layer 4 with a grid-like conductor pattern is formed (refer to figure 1 (3)). The lattice structure of the power supply layer 4 has conductor width / resist width...

Embodiment 3

[0029] In this embodiment, the power supply layer constituting the multilayer printed wiring board was formed as follows.

[0030] First, an interlayer insulating layer 2 made of a heat-resistant resin (PES-epoxy resin series) is formed on the substrate 1, and the surface of the interlayer insulating layer 2 is roughened with a potassium permanganate solution to make it JIS- B0601 Rz = 6 micron rough surface (refer to figure 1 (1)). In addition, the thickness of the interlayer insulating layer 2 after roughening is 35 microns.

[0031] Next, print the desired permanent resist (epoxy resin series) 3 pattern corresponding to the conductor pattern of the power supply layer on the surface of the above-mentioned interlayer insulating layer (refer to figure 1 (2)), by performing electroless copper plating, a power supply layer 4 with a grid-like conductor pattern is formed (refer to figure 1 (3)). Conductor width / resist width=250 μm / 250 μm in the grid structure of the power supp...

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Abstract

The objective of the present invention is to provide a multilayered printed wiring board capable of effectively effectively preventing a conductor layer from swelling and adhesive performances between a resin insulating layer and the conductor from falling, which are cause by residual solvents. The present invention provides a multilayered printed wiring board comprising a resin insulating layer and a conductor layer which lap over a base plate, wherein the conductor layer is composed of at least a signal layer and a power supply layer exhibiting a grid-like conductor pattern.

Description

technical field [0001] The present invention relates to a multilayer printed wiring board, and more particularly to a method of designing a multilayer printed wiring board having a conductor pattern of a power supply layer provided for supplying power to a signal layer. Background technique [0002] In a multilayer printed wiring board formed by stacking interlayer insulating layers and conductive layers, the conductive layers are divided into power supply layers, signal layers, and shield layers according to the application, and are functionalized. The conductor pattern of the above-mentioned power supply layer usually adopts a full pattern with a large surface area. [0003] On the other hand, the multilayer printed wiring board made by the additive method is manufactured by combining the resin insulating layer and the conductor layer alternately on the substrate, and electrically connecting the conductors through the via hole provided on the resin insulating layer. layer...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/09H05K3/46
Inventor 浅井元雄中村明仁
Owner IBIDEN CO LTD
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