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Illuminating device and mfg. method thereof

一种发光器件、反射器的技术，应用在电固体器件、半导体器件、半导体/固态器件零部件等方向，能够解决小片法复杂等问题

Inactive Publication Date: 2005-05-11
CITIZEN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the die method is complicated by many process steps

Method used

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  • Illuminating device and mfg. method thereof
  • Illuminating device and mfg. method thereof
  • Illuminating device and mfg. method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] see figure 1 , which represents a perspective view of a light-emitting device according to a first embodiment of the present invention, a light-emitting device 10 comprising: a substrate 1 made of an insulating material such as epoxy resin, a pair of corresponding electrodes 2, each of which extends as a terminal To the underside of the substrate, the LED 3 mounted on the substrate and soldered to the electrode 2 by means of wire leads.

[0022] LED 3 is designed to emit blue light. The LED 3 is sealed by a first sealing cubic transparent layer 4 made of a transparent resin such as epoxy resin. The first transparent layer 4 is covered by a second parallel tube transparent layer 5 made of a transparent resin such as epoxy resin. Fluorescent material particles such as yttrium aluminum garnet (YAG) and colorant particles are included in the second transparent layer 5 . The outer wall of the second transparent layer 5 except the upper side is covered with a reflector lay...

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PUM

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Abstract

The light emitting device has a substrate, and LEDs mounted on the substrate. The first transparent layer seals the LED, and the second transparent layer is provided around the first transparent layer. Particles of fluorescent material are included in the second transparent layer. The reflector layer is formed on the outer wall except the upper side.

Description

technical field [0001] The present invention relates to light emitting devices using light emitting diodes (LEDs) and methods of manufacturing the same. Background technique [0002] LEDs are fabricated by forming pn junctions on semiconductor wafers containing III-V compounds such as GaP, GaAs, and the like. [0003] Experiments have been carried out to obtain light emitting devices emitting desired colors. Light emitting devices have sealing resins such as epoxy resin and silicone resin. In order to produce the desired color, a fluorescent material is mixed in the sealing resin. [0004] However, since the fluorescent material is heavier than the sealing resin, particles of the fluorescent material are deposited in the resin before the resin is cured. The deposited particles are irregularly dispersed on the LED and the substrate. Therefore, the light emitted by the light emitting device is irregular in color and illuminance distribution. [0005] In another aspect, a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/29H01L23/31H01L33/50H01L33/54H01L33/56H01L33/58H01L33/60H01L33/62
CPCH01L24/97H01L33/505H01L33/54H01L33/58H01L33/60H01L2224/45124H01L2224/48091H01L2224/48227H01L2224/97H01L2924/01005H01L2924/01006H01L2924/01013H01L2924/01023H01L2924/01029H01L2924/01033H01L2924/01039H01L2924/01047H01L2924/01078H01L2924/01079H01L2924/10329H01L2924/12036H01L2924/12041H01L2933/0041H01L2224/85H01L2924/00014H01L2924/00
Inventor 村野由夫
Owner CITIZEN ELECTRONICS CO LTD