Unlock instant, AI-driven research and patent intelligence for your innovation.

Image sensor assembly and its mfg. method

一种图像传感器、组件的技术，应用在图像通信、电固体器件、半导体器件等方向，能够解决图像传感器组件制造工序数和部件数增多、制造成本提高等问题

Inactive Publication Date: 2006-06-14
ROHM CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the prior art described above, it is necessary to prepare the connection cable 204 with the plug 205 and to bond the connection cable 204 to the substrate 201.
Therefore, the number of manufacturing steps and the number of parts of the image sensor module increase, and the manufacturing cost increases.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Image sensor assembly and its mfg. method
  • Image sensor assembly and its mfg. method
  • Image sensor assembly and its mfg. method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

[0025] figure 1 An example of the image sensor module of the present invention is shown. The image sensor module X of this embodiment has a substrate 4 , an image sensor chip 5 , a holder 3 , and a lens holder 1 that holds a lens 2 .

[0026] The substrate 4 is made of, for example, glass epoxy resin, and has a long rectangular shape. On the surface (upper surface) of the substrate 4 , an image sensor chip 5 is mounted offset from the center of the substrate 4 toward one end 4 a in the longitudinal direction thereof. The image sensor chip 5 is, for example, a CCD-type or MOS-type solid-state imaging element. Such as figure 2 As shown, a photosensitive portion 50 and a plurality of electrodes 51 are provided on its upper surface. On the photosensitive part 50, a plurality of photosensitive surfaces in the form of fine dots, not shown in the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

On the substrate (4) of the image sensor assembly (X), a protruding portion (41) protruding toward the side of the support (3) is provided, and on the end (4b) of the protruding portion (41), a A plurality of terminals (81) electrically connected to the sensor chip (5). The process of connecting the image sensor unit (X) to other devices can be easily performed by inserting the end portion (4B) of the protruding portion (41) into a socket-type connector.

Description

technical field [0001] The present invention relates to an image sensor module used as a component of, for example, a digital camera or a mobile phone with a camera, and a method of manufacturing the same. Background technique [0002] Figure 5 An example of a conventional image sensor module is shown. The illustrated image sensor module 100 has a structure in which a holder 103 is mounted on the surface of a substrate 104 on which an image sensor chip 105 is mounted. A lens holder 101 holding a lens 102 is attached to the holder 103 . The light traveling from the object to be photographed passes through the lens 102 , and the image of the object to be photographed is projected on the image sensor chip 105 . On the back surface of the substrate 104, a plurality of terminals 106 electrically connected to the image sensor chip 105 are provided. For example, such an image sensor module 100 is mounted on a main board 107 of a mobile phone, thereby constituting a mobile phone...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146H04N5/335G02B7/02H01L27/14H04N25/00
CPCH01L27/14618H01L27/14625H01L2224/48091H01L2924/3025H04N23/55H04N23/54H01L2924/00014H01L2924/00
Inventor 大西弘朗藤本久义
Owner ROHM CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com