Method for mfg. field luminescence display device

Abstract

To provide a manufacturing method of an electroluminescent display device that can make more appropriately positioning of the mask and the substrate in forming an electroluminescent element through a mask. The method includes the face of the luminous layer constituting the electroluminescent element in the glass substrate 1, on which the deposition is formed, is directed perpendicularly downward and inserted in the vacuum chamber. A mask 30 is arranged in the vacuum chamber. Through the opening of the mask 30, the material of the above luminous layer is adhered and formed on the glass substrate 1, and, thereby, the luminous layer is formed. In positioning the glass substrate 1 and the mask 30, the glass substrate 1 is supported by an electrostatic attraction device 60 at the top face.

Description

technical field [0001] The present invention relates to a method for manufacturing an electroluminescence (Electro Luminescence: EL) display device, in particular to a method for manufacturing an EL display device in which an EL assembly is formed on a substrate surface by shielding. Background technique [0002] In recent years, display devices using EL elements have attracted attention. [0003] The EL component has: an anode made of a transparent electrode such as ITO, an anode made of MTDATA (4,4-bis(3-methylphenyllamino)biphenyl) or (4,4,4-tris(3-methylphenylphenylamino)triphenyl-anine), etc. A structure in which a hole transport layer, a light-emitting layer made of Bebq2 containing Qunacridone derivatives, etc., an electron transport layer made of Bebq2, and an electrode (cathode) made of manganese.indium alloy, etc., are sequentially stacked. Then, a required voltage is applied between the electrodes of the EL element, so that the holes implanted from the anode and ...

AI Technical Summary

Problems solved by technology

However, when the substrate is supported in this manner, it is easy to bend at the center of the substrate.

Therefore, when the substrate is moved to the shield side, the central part of the substrate is first in contact with the shield. If the substrate and the shield are relatively moved in the above state for positioning operation, that is, scratches are generated on the substrate film surface, so that the positioning operation cannot be performed properly. conduct

[0011] And from the point of view of positioning accuracy, or from the point of view of deposition accuracy: it is advisable for the above-mentioned substrate and the shield to be in a very close state, so the above-mentioned problem will definitely be a serious problem.

[0012] Not limited to the above-mentioned vacuum deposition operation, if the formation of EL components, or when the correct positioning of the above-mentioned substrate and shield is required, it is also a common problem due to the difficulty in positioning due to the bending of the substrate

Images