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Object having an electronic unit and conductor structures on a carrier structure

A technology of conductor structure and electronic unit, which is applied in the direction of printed electrical components, electrical components, packaging items, etc., and can solve problems such as limited productivity

Active Publication Date: 2018-04-17
SCHREINER GRP GMBH & CO KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] Existing facilities and processes for assembling or contacting electronic components are also limited in terms of throughput

Method used

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  • Object having an electronic unit and conductor structures on a carrier structure
  • Object having an electronic unit and conductor structures on a carrier structure
  • Object having an electronic unit and conductor structures on a carrier structure

Examples

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Embodiment Construction

[0028] According to the invention it is proposed that, instead of a single foil which is conventionally used as a carrier structure for the electronic unit and the conductor tracks, the carrier structure is designed at least partially, in particular in a part of its base area, as a layer stack, that is to say as a Layer composite comprising at least two films or film sections or two other carrier layer regions which are stacked on top of each other or above each other; possibly with An adhesive layer or other intermediate layer disposed therebetween. Although this requires the addition and processing of an additional film or carrier layer in most of the embodiments that will be described in detail below, it is therefore a priori a priori for those skilled in the art when it comes to reducing costs and manufacturing effort. The solution seems less obvious. However, the additional film or carrier layer achieves that the overall required film area or base area of ​​the carrier s...

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Abstract

The invention relates to an object (100) which comprises at least a first conductor structure (1), at least one electronic unit (5), at least a second conductor structure (2), which is galvanically isolated from the first conductor structure (1) and / or from the electronic unit (5), but can be electrically coupled thereto, and a carrier structure (15) having at least a first carrier layer (10), a first carrier layer region (11) of the first carrier layer (10) and a second carrier layer region (21). The carrier structure (15) is designed as a layer stack (16) in a base surface region (G) which comprises at least a part of the base surface of the carrier structure (15). The layer stack (16) comprises at least the first carrier layer region (11) of the first carrier layer (10) and the second carrier layer region (21). Furthermore, at least a part of the first (1) and the second conductor structure (2) is arranged in the base surface region (G). The first conductor structure (1) and / or theelectronic unit (5) is soldered or bonded to the first carrier layer region (11) or is otherwise connected to the first carrier layer region (11), whereas the second conductor structure (2) is soldered or bonded to the second carrier layer region (12; 21) or otherwise connected to the second carrier layer region (21).

Description

technical field [0001] The present application relates to an article having a conductor structure and an electronic unit on a carrier structure, in particular an article having at least one first conductor structure, at least one electronics unit and at least one second conductor structure on a carrier structure, In this case, the second conductor structure is galvanically isolated from the first conductor structure and / or from the electronics unit, but can be electrically coupled thereto. Background technique [0002] In various technical fields, objects are used which have one or more electronic units mounted on a carrier structure. Such electronic units can be, for example, active or passive components such as resistors, capacitors, coils, other electrical or electronic components or also more complex electronic units such as chips with electronic or microelectronic circuits. The electronics unit can also be a sensor unit which, for example, comprises a sensor element fo...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/14H05K1/16
CPCH05K1/0239H05K1/147H05K1/162H05K1/165H05K2201/049H05K2201/055H05K2201/056H05K2201/09663H05K2201/09672H05K2201/10681A61F13/42A61F2013/424A61J1/035A61J2200/70B65D75/367G01N27/223H05K1/028H05K1/18H05K2201/10015H05K2201/1003H05K2201/10098H05K2201/10151
Inventor 约翰内斯·贝克尔
Owner SCHREINER GRP GMBH & CO KG
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