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Temperature-controlled chuck and method for controlling temperature of substantially flat object

An object, flat technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve difficult and changeable problems, and achieve the effect of low-cost, simple lens design

Inactive Publication Date: 2006-12-20
FREESCALE SEMICON INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The magnitude of these non-linear errors varies widely within the affected area and is therefore difficult to correct using typical photolithographic processes

Method used

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  • Temperature-controlled chuck and method for controlling temperature of substantially flat object
  • Temperature-controlled chuck and method for controlling temperature of substantially flat object
  • Temperature-controlled chuck and method for controlling temperature of substantially flat object

Examples

Experimental program
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Embodiment Construction

[0047] The present invention provides an improved wafer chuck, in particular an improved lithography wafer chuck, which is particularly useful for supporting small wafers as well as large wafers such as having a diameter of eg 300mm.

[0048] figure 1 A simplified side view of the wafer chuck body 20 is shown with a wafer support side 21 and a back side 22 opposite the wafer support side. A plurality of piezoelectric pin elements 4 are distributed on the wafer support side 21 . The upper surfaces 5 of these piezoelectric pins 4 are used to support the backside 3 of the wafer 1 . The wafer 1 also has a front side 2 opposite the wafer back side 3, which is to be exposed in an exposure device.

[0049] Each piezoelectric pin 4 protrudes from the wafer support side 21 of the wafer chuck main body 20 and is evenly distributed on the wafer support side 21, as figure 2 shown. The piezoelectric elements 4 can also be distributed unevenly if desired. An IR fiber 6 is arranged bet...

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PUM

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Abstract

The present invention generally relates to a method for controlling the temperature of a substantially flat object and to a temperature-controlled chuck comprising a chuck body (20) having an object support side (21) and a back side (22). Said object support side (21) holds a substantially flat object (1) having a front side (2) and a back side (3) on said back side (3) of said object (1). A plurality of temperature sensing elements (4) is distributed on said object support side (1) to measure the temperature distribution of said flat object (1). A plurality of individual temperature influencing elements (6; 8; 9) is distributed on said object support side (21) to face said back side (3) of said flat object (1), each of said temperature influencing elements (6; 8; 9) being arranged to influence the temperature of a partial area of said object's back side (3) as desired.

Description

technical field [0001] The present invention generally relates to controlling the temperature of a subregion on a substantially flat object. More particularly, the present invention relates to a temperature controlled chuck for supporting a substantially planar object. With such a temperature-controlled chuck, it is possible to detect or measure the temperature distribution on an essentially flat object, and to change the temperature over a partial area of ​​the rear side of the object with a temperature-influencing element in order to obtain a more uniform temperature distribution. Additionally, the present invention relates to a temperature controlled wafer chuck and method for controlling the temperature on a substantially flat object such as a wafer. Finally, the invention also relates to a pre-alignment station for use on a wafer in an exposure apparatus comprising a temperature-controlled wafer chuck, and to a pre-alignment station for a wafer in an exposure apparatus c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/027
CPCH01L21/67103H01L21/68
Inventor 约翰·G·马尔塔比斯阿兰·B·查尔斯卡尔·E·莫茨
Owner FREESCALE SEMICON INC