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Method of manufacturing modules with an integrated circuit

A technology of integrated circuits and circuit structures, applied in the field of manufacturing modules, can solve the problems such as the inability to use polymers, and achieve the effect of a simple and economical manufacturing method and fewer processing steps

Inactive Publication Date: 2007-02-28
NXP BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Known methods cannot be applied to polymer ICs fabricated on such plastic flexible films

Method used

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  • Method of manufacturing modules with an integrated circuit
  • Method of manufacturing modules with an integrated circuit
  • Method of manufacturing modules with an integrated circuit

Examples

Experimental program
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Embodiment Construction

[0020] FIG. 1 schematically shows a circuit arrangement 1 . The circuit structure 1 in this case is in the form of a flexible film made of plastic. The circuit structure 1 comprises a plurality of integrated circuits 2 fabricated on a polymer substrate. The integrated circuits 2 in this case have a certain distance from each other, which is necessary in order to be able to separate the integrated circuits 2 along the separation zone 3, thereby allowing the integrated circuits 2 to be separated. The separation zone 3 is indicated by the dashed diagram in FIG. 1 . Each of the integrated circuits 2 has two connection contacts (or "bumps"), which are not shown in Figures 1-4. The connection contacts of the integrated circuit 2 are located in the region of the delimiting surface A of the circuit structure 1 , which is visible in FIG. 1 .

[0021] The inventive method for manufacturing a module 4 according to the invention will be described with reference to FIGS. 1-4 . FIG. 4 s...

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Abstract

In a method of manufacturing modules (4), each with at least one integrated circuit (2), the integrated circuits (2) are separated from a previously manufactured circuit configuration (1), which is in the form of a flexible film comprising a plurality of integrated circuits (2) on the basis of a polymer, by a combined stamping-vacuum conveying device (6), after which each of the separated integrated circuits (2) is conveyed to a module substrate (5) and connected to the module substrate (5) so as to form a module (4).

Description

technical field [0001] The invention relates to a method of manufacturing modules, wherein each module comprises at least one integrated circuit, the integrated circuit is separated from a circuit structure comprising a plurality of integrated circuits, and wherein each separated integrated circuit is subsequently transferred to the module substrate and connected to the module substrate to form a module. [0002] The invention also relates to a module having a module substrate and at least one integrated circuit connected to the module substrate to form the module. [0003] The invention also relates to a transponder with a module comprising a module substrate and at least one integrated circuit, which is connected to the module substrate to form a module and which has connection contacts to the transmitting means of the transponder . Background technique [0004] The methods described in the first paragraph are well known. This known method is a method for manufacturing ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L51/05G06K19/07G06K19/077H01L27/00H01L21/52H01L21/60H01L21/683H01L25/04H01L27/28
CPCH01L2924/14H01L21/67144H01L21/6838H01L2224/83192H01L24/81G06K19/077H01L27/28H01L21/67132H01L2924/014H01L2224/81801H01L25/046H10K19/901H10K19/00
Inventor C·布鲁格R·弗里茨A·A·兰格J·H·M·鲁斯马伦J·W·维坎普
Owner NXP BV