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Method of manufacturing modules with an integrated circuit

A technology of integrated circuit and circuit structure, which is applied in the field of manufacturing modules, can solve the problems of not being able to apply polymers, etc., and achieve the effect of high manufacturing precision and manufacturing reliability, simple and economical manufacturing methods

Inactive Publication Date: 2005-02-09
NXP BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Known methods cannot be applied to polymer ICs fabricated on such plastic flexible films

Method used

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  • Method of manufacturing modules with an integrated circuit
  • Method of manufacturing modules with an integrated circuit
  • Method of manufacturing modules with an integrated circuit

Examples

Experimental program
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Embodiment Construction

[0019] figure 1 The circuit arrangement 1 is shown schematically. The circuit structure 1 in this case is in the form of a flexible film made of plastic. The circuit structure 1 comprises a plurality of integrated circuits 2 fabricated on a polymer substrate. The integrated circuits 2 in this case have a certain distance from each other, which is necessary in order to be able to separate the integrated circuits 2 along the separation zone 3, thereby allowing the integrated circuits 2 to be separated. Separation Zone 3 by figure 1 indicated by the dotted line icon. Each of the integrated circuits 2 has two connection contacts (or "bumps") which are Figure 1-4 not shown in . Said connection contacts of the integrated circuit 2 are located in the region of the delimiting surface A of the circuit structure 1, said delimiting surface A being figure 1 is visible in .

[0020] The method of the invention for manufacturing a module 4 according to the invention by reference to ...

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Abstract

In a method of manufacturing modules (4), each with at least one integrated circuit (2), the integrated circuits (2) are separated from a previously manufactured circuit configuration (1), which is in the form of a flexible film comprising a plurality of integrated circuits (2) on the basis of a polymer, by a combined stamping-vacuum conveying device (6), after which each of the separated integrated circuits (2) is conveyed to a module substrate (5) and connected to the module substrate (5) so as to form a module (4).

Description

technical field [0001] The invention relates to a method of manufacturing modules, each of which includes at least one integrated circuit, the integrated circuit being separated from a previously realized circuit structure comprising a plurality of integrated circuits, and each of the separated integrated circuits subsequently is transferred to a module substrate and connected to the module substrate to form a module. [0002] The invention also relates to a module having a module substrate and at least one integrated circuit connected to the module substrate to form the module. [0003] The invention also relates to a transponder with a module comprising a module substrate and at least one integrated circuit, which is connected to the module substrate to form a module and which has connection contacts to the transmitting means of the transponder . Background technique [0004] The methods described in the first paragraph are well known. This known method is a method for ...

Claims

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Application Information

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IPC IPC(8): H01L21/52G06K19/07G06K19/077H01L21/00H01L21/60H01L21/683H01L25/04H01L27/00H01L27/28
CPCH01L2924/14H01L21/67144H01L21/6838H01L24/81H01L2224/83192G06K19/077H01L21/67132H01L27/28H01L2924/014H01L2224/81801H01L25/046H10K19/901H10K19/00
Inventor C·布鲁格R·弗里茨A·A·兰格J·H·M·鲁斯马伦J·W·维坎普
Owner NXP BV