Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for manufacturing thin-film transistor

A technology of thin film transistor and manufacturing method, applied in semiconductor/solid-state device manufacturing, semiconductor device, optics, etc., can solve problems such as blistering

Active Publication Date: 2007-05-23
AU OPTRONICS CORP
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The material is silicon nitride (SiN x ) of the gate insulating layer as an example, the problem of blistering may occur

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for manufacturing thin-film transistor
  • Method for manufacturing thin-film transistor
  • Method for manufacturing thin-film transistor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] As shown in Figure 1, during the deposition of the gate insulating layer, the copper gate electrodes and gate lines are exposed to an ammonia-containing plasma environment and cause adhesion and interaction problems. In order to avoid these problems, it is proposed to deposit a layer of microcrystalline layer (such as microcrystalline silicon) and perform plasma treatment (such as nitrogen plasma treatment) to deposit gate insulation by plasma-enhanced chemical vapor deposition. Before layering, cover a thin layer of buffer layer on the copper gate electrode surface.

[0017] 2A to 2D show a method of manufacturing a thin film transistor according to an embodiment of the present invention.

[0018] First please refer to FIG. 2A , a substrate 902 is provided, such as a glass substrate, and its thickness is, for example, less than 1mm, and then a layer of low-resistance metal layer is formed on the substrate 902, and its material is, for example, copper, silver, aluminum,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The film transistor making process includes forming grid electrode and subsequent step of depositing microcrystal film and the step of plasma treatment. The step of depositing microcrystal film and the step of plasma treatment may be repeated so as to form buffering layer on the grid electrode.

Description

technical field [0001] The present invention relates to a method for manufacturing a thin film transistor (thin film transistor, TFT), in particular to a method for manufacturing a thin film transistor with a structure capable of protecting a gate electrode. Background technique [0002] Thin film transistors are active elements commonly used in active matrix flat panel displays, which are usually used to drive active matrix type liquid crystal displays (active matrix type liquid crystal displays), active matrix type organic light emitting displays (active matrix type organic light -emitting display), image sensor and other devices. [0003] Taking a liquid crystal display as an example, the liquid crystal layer is sandwiched between two transparent glass substrates, and a thin film transistor is disposed above one of the transparent substrates. In a display area of ​​a liquid crystal display, a matrix of pixel areas is defined by horizontally extending gate lines and verti...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/336H01L21/28G02F1/136
Inventor 甘丰源林汉涂
Owner AU OPTRONICS CORP